Application Note P13683EJ2V0AN00
4
CONTENTS
1.
INTRODUCTION.............................................................................................................................
5
2.
OVERVIEW OF PRODUCTS..........................................................................................................
2.1 Characteristics and Sizes.....................................................................................................
6
6
3.
INTERNAL CIRCUIT CONFIGURATION .......................................................................................
3.1 Differences Between
μ
PC8106,
μ
PC8109 and
μ
PC8163.....................................................
3.2 Internal Circuits and Frequency Bandwidth.......................................................................
8
8
8
4.
EXTERNAL CIRCUIT CONFIGURATION......................................................................................
4.1 Impedance Matching at RF Output......................................................................................
4.2 Input Impedance Matching ...................................................................................................
4.3 Bypass Capacitor ..................................................................................................................
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10
10
10
5.
APPLICATION CHARACTERISTICS.............................................................................................
5.1 Operating Rise/Fall Times.....................................................................................................
5.2 Leakage and Isolation Characteristics................................................................................
5.3 Spurious Characteristics......................................................................................................
5.4 Adjacent Channel Interference Power.................................................................................
25
25
29
32
35
6.
SYSTEM CONFIGURATION EXAMPLES .....................................................................................
53
7.
APPLICATION CIRCUIT EXAMPLE ..............................................................................................
7.1 Dual Band...............................................................................................................................
54
54
8.
CONCLUSION ................................................................................................................................
References.....................................................................................................................................
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Use-Related Cautions
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation). All
the ground pins must be wired as short as possible to decrease impedance difference (this also helps prevent
operation faults, abnormal oscillation, etc.).
(3) The bypass capacitor should be attached to the V
CC
pin.
(4) The RF output pin connects an external LC matching circuit’s parallel inductor to V
CC
to apply a bias and RF
load.
(5) The DC cut capacitor must be attached to the input pin. The input pins’ voltage must not be externally adjusted.
(6) A capacitor (such as a 100 pF capacitor) should be attached between the PS and V
CC
pins.
See each product’s data sheet for more detailed cautions and descriptions of electrical characteristics.
μ
PC8106T,
μ
PC8109T Data Sheet (Document No. P10656E)
μ
PC8106TB,
μ
PC8109TB Data Sheet (Document No. P12770E)
μ
PC8163TB Data Sheet (Document No. P13636E)