參數資料
型號： P1803AA
英文描述： SIDAC|210V V(BO) MAX|800MA I(S)|TO-220VAR
中文描述： SIDAC的|高達210V五（公報）最大| 800mA的我（縣）|對220VAR
文件頁數： 132/161頁
文件大?。?/td> 986K
代理商： P1803AA
Soldering Recommendations
SIDACtor
Data Book
5 - 16
Teccor Electronics
(972) 580-7777
$
Overview
When placing surface mount components, a good solder bond is critical because:
1. The solder provides a thermal path in which heat is dissipated from the
packaged silicon to the rest of the board.
2. A good bond is less subject to thermal fatiguing and results in improved component
reliability.
Reflow Soldering
The preferred technique for mounting the DO-214 package is to reflow-solder the
device onto a PCB - printed circuit board. (Figure 5-6).
Figure 5-6 Reflow Soldering Procedure
For reliable connections, the PCB should first be screen printed with a solder paste or
fluxed with a reliable solution that is easily removed such as Alpha 5003 diluted with
benzyl alcohol. If using a flux, the PCB should be allowed to dry to touch at room
temperature (or in a 70
°
C oven) prior to placing the components on the solder pads.
Relying on the adhesive nature of the solder paste or flux to prevent the devices from
moving prior to reflow, components should be placed with either a vacuum pencil or
automated pick and place machine.
With the components in place, the PCB should be heated to a point where the solder
on the pads begins to flow. This is typically done on a conveyor belt which first
transports the PCB through a pre-heating zone. The pre-heating zone is necessary in
order to reduce thermal shock and prevent damage to the devices being soldered, and
should be limited to a maximum temperature of 165
°
C for 10 seconds.
After pre-heating, the PCB goes to a vapor zone. The vapor zone is obtained by
heating an inactive fluid to its boiling point while using a vapor lock to regulate the
chamber temperature. This temperature is typically 215
°
C, but for temperatures in
1. Screen print solder paste
(or flux)
2. Place component
(allow flux to dry)
3. Reflow solder
相關PDF資料
PDF描述
P1803AARP SIDAC|210V V(BO) MAX|800MA I(S)|TO-220VAR
P1803AB SIDAC|210V V(BO) MAX|800MA I(S)|TO-220VAR
P1803ABRP SIDAC|210V V(BO) MAX|800MA I(S)|TO-220VAR
P1803AC SIDAC|210V V(BO) MAX|800MA I(S)|TO-220VAR
P1803ACRP SIDAC|210V V(BO) MAX|800MA I(S)|TO-220VAR
相關代理商/技術參數
參數描述
P1803AAL 功能描述:硅對稱二端開關元件 3Chp 150V 50A RoHS:否 制造商:Bourns 轉折電流 VBO:40 V 最大轉折電流 IBO:800 mA 不重復通態(tài)電流: 額定重復關閉狀態(tài)電壓 VDRM:25 V 關閉狀態(tài)漏泄電流（在 VDRM IDRM 下）: 保持電流（Ih 最大值）:50 mA 開啟狀態(tài)電壓:5 V 關閉狀態(tài)電容 CO:120 pF 最大工作溫度:+ 150 C 安裝風格:SMD/SMT 封裝 / 箱體:DO-214AA
P1803AALRP 功能描述:硅對稱二端開關元件 3Chp 150V 50A RoHS:否 制造商:Bourns 轉折電流 VBO:40 V 最大轉折電流 IBO:800 mA 不重復通態(tài)電流: 額定重復關閉狀態(tài)電壓 VDRM:25 V 關閉狀態(tài)漏泄電流（在 VDRM IDRM 下）: 保持電流（Ih 最大值）:50 mA 開啟狀態(tài)電壓:5 V 關閉狀態(tài)電容 CO:120 pF 最大工作溫度:+ 150 C 安裝風格:SMD/SMT 封裝 / 箱體:DO-214AA
P1803AALxx 制造商:LITTELFUSE 制造商全稱:Littelfuse 功能描述:Balanced overvoltage
P1803AARP 功能描述:硅對稱二端開關元件 3Chp 150V 50A RoHS:否 制造商:Bourns 轉折電流 VBO:40 V 最大轉折電流 IBO:800 mA 不重復通態(tài)電流: 額定重復關閉狀態(tài)電壓 VDRM:25 V 關閉狀態(tài)漏泄電流（在 VDRM IDRM 下）: 保持電流（Ih 最大值）:50 mA 開啟狀態(tài)電壓:5 V 關閉狀態(tài)電容 CO:120 pF 最大工作溫度:+ 150 C 安裝風格:SMD/SMT 封裝 / 箱體:DO-214AA
P1803AB 功能描述:硅對稱二端開關元件 3Chp 150V 100A RoHS:否 制造商:Bourns 轉折電流 VBO:40 V 最大轉折電流 IBO:800 mA 不重復通態(tài)電流: 額定重復關閉狀態(tài)電壓 VDRM:25 V 關閉狀態(tài)漏泄電流（在 VDRM IDRM 下）: 保持電流（Ih 最大值）:50 mA 開啟狀態(tài)電壓:5 V 關閉狀態(tài)電容 CO:120 pF 最大工作溫度:+ 150 C 安裝風格:SMD/SMT 封裝 / 箱體:DO-214AA
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