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PC500.B (5/02)
US 858 674 8100
UK 44 1483 401 700
France 33 3 84 35 04 04
Singapore 65 287 8998
Taiwan 886 2 2698 0228
Hong Kong 852 2788 6588
http://www.pulseeng.com
SMT POWER INDUCTORS
For Use with Volterra's Chipset
Notes from Tables
1. The rated current as listed is either the saturation current or the
heating current depending on which value is lower.
2. The saturation current is the current which causes the
inductance to drop by 10% at the stated ambient temperatures
(-40°C, 25°C, 125°C). This current is determined by placing the
component in the specified ambient environment and applying
a short duration pulse current (to eliminate self-heating effects)
to the component.
3. The heating current is the dc current which causes the tempera-
ture of the part to increase by approximately 30°C. This current
is determined by mounting the component on a PCB with .25"
wide, 3 oz. equivalent copper traces, and applying the current
to the device for 30 minutes.
4. In high volt*time applications, additional heating in the
component can occur due to core losses in the inductor
which may neccessitate derating the current in order to limit
the temperature rise of the component. In order to determine
the approximate total losses (or temperature rise) for a given
application both copper losses and core losses should be
taken into account.
Estimated Temperature Rise:
Trise
= Coreloss (mW) + DCRloss (mW)
.833
(°C)
K0
Coreloss
= K1 *
(
Fsw(kHz)
)
1.6688
* (K2 * dI)
2.17
(mW)
DCRloss
= Irms
2
* DCR(m
) (mW)
Irms
= IDC
2
+ dI
2
(Arms)
2
Fsw(kHz)
= switching frequency (kHz)
dI
= delta I across the component (A)
The temperature of the component (ambient temperature +
temperature rise) should be within the listed operating
temperature range.
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Inductance vs Current Characteristics