參數(shù)資料
型號: P2300SARP
英文描述: MCU CMOS 44 LD LOW PWR, 0C to +70C, 44-PLCC, TUBE
中文描述: SIDAC的| 260伏特五(公報)最大| 800mA的我(縣)|的DO - 214AA
文件頁數(shù): 134/161頁
文件大?。?/td> 986K
代理商: P2300SARP
Soldering Recommendations
SIDACtor
Data Book
5 - 18
Teccor Electronics
(972) 580-7777
Wave Soldering
Another common method for soldering components to a PCB is wave soldering. After
fluxing the PCB, an adhesive is applied to the respective footprints such that
components can be glued in place. Once the adhesive has cured, the board is pre-
heated and then placed in contact with a molten wave of solder which has a
temperature between 240
°
C - 260
°
C and permanently affixes the component to the
PCB.
Although a popular method of soldering, wave soldering does have some drawbacks:
1. A double pass is often required to remove excess solder.
2. Solder bridging and shadows begin to occur as board density increases.
3. Wave soldering utilizes the sharpest thermal gradient.
Figure 5-9 Wave Soldering Surface Mount Components Only
Figure 5-10 Wave Soldering Surface Mount and Leaded Components
Apply glue
Screen print glue
Place component
Cure glue
Wave solder
PC board
Insert
leaded
components
Turn over
PC board
Apply
glue
Place
SMDs
Cure
glue
Turn over
PC board
Wave solder
相關PDF資料
PDF描述
P2300SBRP MCU CMOS 44 LD LOW PWR, -40C to +85C, 44-PLCC, TUBE
P2300SCRP MCU CMOS 44 LD LOW PWR, -40C to +85C, 44-TQFP, TRAY
P2353AA MCU CMOS 68 LD 33MHZ 8K EPRM, 0C to +70C, 68-PLCC, TUBE
P2353AARP SIDAC|270V V(BO) MAX|800MA I(S)|TO-220VAR
P2353AB MCU CMOS 64 LD 33MHZ 8K EPRM, -40C to +85C, 64-TQFP, TRAY
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