參數(shù)資料
型號(hào)： P2600SBRP
英文描述： MCU CMOS 40 LD 40MHZ 16K OTP, -40C to +125C, 40-PDIP, TUBE
中文描述： SIDAC的| 300V五（公報(bào)）最大| 800mA的我（縣）|的DO - 214AA
文件頁數(shù)： 133/161頁
文件大小： 986K
代理商： P2600SBRP
SIDACtor
Data Book
Soldering Recommendations
Teccor Electronics
(972) 580-7777
5 - 17
T
excess of 215
°
C, care should be taken such that the maximum temperature of the
leads does not exceed 275
°
C and the maximum temperature of the plastic body does
not exceed 250
°
C (Figure 5-8).
Figure 5-7 Principle of Vapor Phase Soldering
Figure 5-8 Reflow Soldering Profile
During reflow, the surface tension of the liquid solder will draw the leads of the device
towards the center of the soldering area, correcting any misalignment that may have
occurred during placement and allowing the device to set flush on the pad. However, if
the footprints of the pad are not concentrically aligned, the same effect can result in
undesirable shifts as well, hence the importance of using a standard contact pattern
which leaves sufficient room for self-positioning.
After the solder has cooled, connections should be visually inspected and remnants of
the flux removed using a vapor degreaser with an azeotrope solvent or equivalent.
Transport
Cooling pipes
PC board
Heating
elements
Boiling liquid (primary medium)
Vapor phase
zone
Vapor lock
(secondary
medium)
Time (Seconds)
0
0
20
40
60
80
100
120
140
160
180
200
220
240
30
60
90
120
150
180
210
240
270
300
T
C
Pre-Heat
Soak
Reflow
Cool
Down
0.5 - 0.6
C/Sec
1.3 - 1.6
C/Sec
<2.5
C/Sec
<2.5
C/Sec
Peak Temp.
210 - 235
C
Soaking Zone
Reflow Zone
Pre-heating Zone
( 2.0 - 4.0 min. max. )
( 2.0 min. max. )
60 - 90 sec. typical
( 2.0 min. max. )
30 - 60 sec. typical
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