參數(shù)資料
型號： P3002AB
英文描述： SIDAC|180V V(BO) MAX|800MA I(S)|TO-220VAR
中文描述： SIDAC的| 180V五（公報）最大| 800mA的我（縣）|對220VAR
文件頁數(shù)： 130/161頁
文件大?。?/td> 986K
代理商： P3002AB
PCB Layout
SIDACtor
Data Book
5 - 14
Teccor Electronics
(972) 580-7777
The minimum width and thickness of conductors on a PCB is determined primarily by
the current-carrying capacity required. This current carrying capacity is limited by the
allowable temperature rise of the etched copper conductor. An adjacent ground or
power layer can significantly reduce this temperature rise. A single ground plane can
generally raise the allowed current by 50 percent. An easy approximation can be
generated by starting with Figure 5-4 to calculate the conductor cross sectional area
required. Once this has been done, Figure 5-5 converts the cross sectional area to the
required conductor width dependent on the copper foil thickness of the trace.
Figure 5-5 Conductor Width vs. Area
Trace Separation
Because Tip and Ring traces are subjected to transient conditions, they should be
routed towards the edge of the PCB away from sensitive areas, and should maintain a
minimum separation of 2.5mm between themselves and other traces. A good rule of
thumb for separation of non-coated top layer traces is to maintain spacing equal to
.010mm per volt.
Grounding
Although often overlooked, grounding is a very important design consideration when
laying out a protection interface circuit. To optimize its effectiveness, several things
should be considered.
The first is that a large copper plane should be provided using a grid pattern for the
ground reference point.
Next, it should be decided if a single point or a multi point grounding scheme is to be
used. A single-point (also called centralized) grounding scheme is used for circuit
dimensions smaller than one-tenth of a wavelength (
λ
= 300,000/F
kHz
) and a multi
point (also called distributed) grounding scheme is used for circuit trace lengths
0
.350
.300
.250
.030
.050
.070
.100
.150
.200
.010
.020
.005
.001
0
1
10
20
100 150
300
400
500
600
700
Conductor Cross-Section Area (sq mils)
5
30 50 70
200
250
C
0
"
7
0
0
0
2
t
o
2
"
4
1
0
0
2
t
o
1
(2oz/ft2 .0028"
(3oz/ft2) .0042"
相關PDF資料
PDF描述
P3002ABRP SIDAC|180V V(BO) MAX|800MA I(S)|TO-220VAR
P3002AC SIDAC|180V V(BO) MAX|800MA I(S)|TO-220VAR
P3002ACRP SIDAC|180V V(BO) MAX|800MA I(S)|TO-220VAR
P3100SCRP SIDAC|350V V(BO) MAX|800MA I(S)|DO-214AA
P3203AA SIDAC|350V V(BO) MAX|800MA I(S)|TO-220VAR
相關代理商/技術(shù)參數(shù)
參數(shù)描述
P3002AB_ 功能描述:硅對稱二端開關元件 - Use 576-P3002AB RoHS:否 制造商:Bourns 轉(zhuǎn)折電流 VBO:40 V 最大轉(zhuǎn)折電流 IBO:800 mA 不重復通態(tài)電流: 額定重復關閉狀態(tài)電壓 VDRM:25 V 關閉狀態(tài)漏泄電流（在 VDRM IDRM 下）: 保持電流（Ih 最大值）:50 mA 開啟狀態(tài)電壓:5 V 關閉狀態(tài)電容 CO:120 pF 最大工作溫度:+ 150 C 安裝風格:SMD/SMT 封裝 / 箱體:DO-214AA
P3002AB60 功能描述:硅對稱二端開關元件 100A 140/280V RoHS:否 制造商:Bourns 轉(zhuǎn)折電流 VBO:40 V 最大轉(zhuǎn)折電流 IBO:800 mA 不重復通態(tài)電流: 額定重復關閉狀態(tài)電壓 VDRM:25 V 關閉狀態(tài)漏泄電流（在 VDRM IDRM 下）: 保持電流（Ih 最大值）:50 mA 開啟狀態(tài)電壓:5 V 關閉狀態(tài)電容 CO:120 pF 最大工作溫度:+ 150 C 安裝風格:SMD/SMT 封裝 / 箱體:DO-214AA
P3002AB61 功能描述:硅對稱二端開關元件 100A 140/280V RoHS:否 制造商:Bourns 轉(zhuǎn)折電流 VBO:40 V 最大轉(zhuǎn)折電流 IBO:800 mA 不重復通態(tài)電流: 額定重復關閉狀態(tài)電壓 VDRM:25 V 關閉狀態(tài)漏泄電流（在 VDRM IDRM 下）: 保持電流（Ih 最大值）:50 mA 開啟狀態(tài)電壓:5 V 關閉狀態(tài)電容 CO:120 pF 最大工作溫度:+ 150 C 安裝風格:SMD/SMT 封裝 / 箱體:DO-214AA
P3002AB61RP 功能描述:硅對稱二端開關元件 140/280V 100A TO220A SIDACtor SYM 2Chp RoHS:否 制造商:Bourns 轉(zhuǎn)折電流 VBO:40 V 最大轉(zhuǎn)折電流 IBO:800 mA 不重復通態(tài)電流: 額定重復關閉狀態(tài)電壓 VDRM:25 V 關閉狀態(tài)漏泄電流（在 VDRM IDRM 下）: 保持電流（Ih 最大值）:50 mA 開啟狀態(tài)電壓:5 V 關閉狀態(tài)電容 CO:120 pF 最大工作溫度:+ 150 C 安裝風格:SMD/SMT 封裝 / 箱體:DO-214AA
P3002AB62 功能描述:硅對稱二端開關元件 100A 140/280V RoHS:否 制造商:Bourns 轉(zhuǎn)折電流 VBO:40 V 最大轉(zhuǎn)折電流 IBO:800 mA 不重復通態(tài)電流: 額定重復關閉狀態(tài)電壓 VDRM:25 V 關閉狀態(tài)漏泄電流（在 VDRM IDRM 下）: 保持電流（Ih 最大值）:50 mA 開啟狀態(tài)電壓:5 V 關閉狀態(tài)電容 CO:120 pF 最大工作溫度:+ 150 C 安裝風格:SMD/SMT 封裝 / 箱體:DO-214AA
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