參數(shù)資料
型號： P3100ECRP1
英文描述： SIDAC|350V V(BO) MAX|800MA I(S)|TO-92VAR
中文描述： SIDAC的| 350V五（公報）最大| 800mA的我（縣）|對92VAR
文件頁數(shù)： 132/161頁
文件大?。?/td> 986K
代理商： P3100ECRP1
Soldering Recommendations
SIDACtor
Data Book
5 - 16
Teccor Electronics
(972) 580-7777
$
Overview
When placing surface mount components, a good solder bond is critical because:
1. The solder provides a thermal path in which heat is dissipated from the
packaged silicon to the rest of the board.
2. A good bond is less subject to thermal fatiguing and results in improved component
reliability.
Reflow Soldering
The preferred technique for mounting the DO-214 package is to reflow-solder the
device onto a PCB - printed circuit board. (Figure 5-6).
Figure 5-6 Reflow Soldering Procedure
For reliable connections, the PCB should first be screen printed with a solder paste or
fluxed with a reliable solution that is easily removed such as Alpha 5003 diluted with
benzyl alcohol. If using a flux, the PCB should be allowed to dry to touch at room
temperature (or in a 70
°
C oven) prior to placing the components on the solder pads.
Relying on the adhesive nature of the solder paste or flux to prevent the devices from
moving prior to reflow, components should be placed with either a vacuum pencil or
automated pick and place machine.
With the components in place, the PCB should be heated to a point where the solder
on the pads begins to flow. This is typically done on a conveyor belt which first
transports the PCB through a pre-heating zone. The pre-heating zone is necessary in
order to reduce thermal shock and prevent damage to the devices being soldered, and
should be limited to a maximum temperature of 165
°
C for 10 seconds.
After pre-heating, the PCB goes to a vapor zone. The vapor zone is obtained by
heating an inactive fluid to its boiling point while using a vapor lock to regulate the
chamber temperature. This temperature is typically 215
°
C, but for temperatures in
1. Screen print solder paste
(or flux)
2. Place component
(allow flux to dry)
3. Reflow solder
相關(guān)PDF資料
PDF描述
P3100ECRP2 SIDAC|350V V(BO) MAX|800MA I(S)|TO-92VAR
P3100SARP SIDAC|350V V(BO) MAX|800MA I(S)|DO-214AA
P3100SBRP SIDAC|350V V(BO) MAX|800MA I(S)|DO-214AA
P3300AA61RP SIDAC|360V V(BO) MAX|800MA I(S)|TO-220VAR
P3500EA 44 PIN, 32 KB ENH FLASH, 1536 RAM, 36 I/O, -40C to +125C, 44-QFN, TUBE
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
P3100ECRP2 功能描述:硅對稱二端開關(guān)元件 500A 275V RoHS:否 制造商:Bourns 轉(zhuǎn)折電流 VBO:40 V 最大轉(zhuǎn)折電流 IBO:800 mA 不重復(fù)通態(tài)電流: 額定重復(fù)關(guān)閉狀態(tài)電壓 VDRM:25 V 關(guān)閉狀態(tài)漏泄電流（在 VDRM IDRM 下）: 保持電流（Ih 最大值）:50 mA 開啟狀態(tài)電壓:5 V 關(guān)閉狀態(tài)電容 CO:120 pF 最大工作溫度:+ 150 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DO-214AA
P3100G_LRP 制造商:LITTELFUSE 制造商全稱:Littelfuse 功能描述:Teccor㈢ brand Protection Thyristors
P3100GALRP 功能描述:硅對稱二端開關(guān)元件 275V 50A DO15 SIDACtor Bi RoHS:否 制造商:Bourns 轉(zhuǎn)折電流 VBO:40 V 最大轉(zhuǎn)折電流 IBO:800 mA 不重復(fù)通態(tài)電流: 額定重復(fù)關(guān)閉狀態(tài)電壓 VDRM:25 V 關(guān)閉狀態(tài)漏泄電流（在 VDRM IDRM 下）: 保持電流（Ih 最大值）:50 mA 開啟狀態(tài)電壓:5 V 關(guān)閉狀態(tài)電容 CO:120 pF 最大工作溫度:+ 150 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DO-214AA
P3100GBLRP 功能描述:硅對稱二端開關(guān)元件 275V 80A DO15 SIDACtor Bi RoHS:否 制造商:Bourns 轉(zhuǎn)折電流 VBO:40 V 最大轉(zhuǎn)折電流 IBO:800 mA 不重復(fù)通態(tài)電流: 額定重復(fù)關(guān)閉狀態(tài)電壓 VDRM:25 V 關(guān)閉狀態(tài)漏泄電流（在 VDRM IDRM 下）: 保持電流（Ih 最大值）:50 mA 開啟狀態(tài)電壓:5 V 關(guān)閉狀態(tài)電容 CO:120 pF 最大工作溫度:+ 150 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DO-214AA
P3100IGSVB 制造商:Eaton Corporation 功能描述:SWITCH DISCONNECTOR 100A
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