參數(shù)資料
型號: P6002AC
英文描述: SIDAC|350V V(BO) MAX|800MA I(S)|TO-220VAR
中文描述: SIDAC的| 350V五(公報)最大| 800mA的我(縣)|對220VAR
文件頁數(shù): 134/161頁
文件大?。?/td> 986K
代理商: P6002AC
Soldering Recommendations
SIDACtor
Data Book
5 - 18
Teccor Electronics
(972) 580-7777
Wave Soldering
Another common method for soldering components to a PCB is wave soldering. After
fluxing the PCB, an adhesive is applied to the respective footprints such that
components can be glued in place. Once the adhesive has cured, the board is pre-
heated and then placed in contact with a molten wave of solder which has a
temperature between 240
°
C - 260
°
C and permanently affixes the component to the
PCB.
Although a popular method of soldering, wave soldering does have some drawbacks:
1. A double pass is often required to remove excess solder.
2. Solder bridging and shadows begin to occur as board density increases.
3. Wave soldering utilizes the sharpest thermal gradient.
Figure 5-9 Wave Soldering Surface Mount Components Only
Figure 5-10 Wave Soldering Surface Mount and Leaded Components
Apply glue
Screen print glue
Place component
Cure glue
Wave solder
PC board
Insert
leaded
components
Turn over
PC board
Apply
glue
Place
SMDs
Cure
glue
Turn over
PC board
Wave solder
相關(guān)PDF資料
PDF描述
P6002ACRP SIDAC|350V V(BO) MAX|800MA I(S)|TO-220VAR
P0080EARP1 MCU CMOS 44 LD 10MHZ 4K EPRM, 0C to +70C, 44-MQFP, TRAY
P0080EARP2 MCU CMOS 44 LD 10MHZ 4K EPRM, -40C to +125C, 44-PLCC, TUBE
P0080EB MCU CMOS 44 LD 10MHZ 4K EPRM, -40C to +85C, 44-PLCC, TUBE
P0080EBRP1 MCU CMOS 44 LD 10MHZ 4K EPRM, -40C to +85C, 44-MQFP, TRAY
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