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參數(shù)資料
| 型號(hào)： | P83CL883T |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | TELX microcontrollers for CT0 handset/basestation applications |
| 中文描述： | TELX微控制器CT0手機(jī)/基站應(yīng)用 |
| 文件頁數(shù)： | 28/32頁 |
| 文件大小： | 145K |
| 代理商： | P83CL883T |
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28
Philips Semiconductors
Product specification
TELX microcontrollers for CT0
handset/basestation applications
P8xCL883; P8xCL884
10.5
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW
(1)
BGA, SQFP
HLQFP, HSQFP, HSOP, HTSSOP, SMS not suitable
(2)
PLCC
(3)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
not suitable
suitable
suitable
suitable
suitable
suitable
suitable
not recommended
(3)(4)
not recommended
(5)
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| P87CL884T | TELX microcontrollers for CT0 handset/basestation applications |
| P8503BMG | N-Channel Logic Level Enhancement Mode Field Effect Transistor (Preliminary) |
| P85C220-66 | UV-Erasable/OTP PLD |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| P83CL883T/XXX | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:MICROCONTROLLER|8-BIT|8051 CPU|CMOS|SOP|28PIN|PLASTIC |
| P83CL884T | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:TELX microcontrollers for CT0 handset/basestation applications |
| P83CL884T/XXX | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:8-Bit Microcontroller |
| P83LPC912FDHCV961, | 功能描述:8位微控制器 -MCU P83LPC912FDH/TSSOP14/REEL13//C RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT |
| P83LPC913FDH/CV960 | 功能描述:8位微控制器 -MCU P83LPC913FDH/TSSOP14/REEL13//C RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT |
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