參數(shù)資料
型號： PC7457
廠商： Atmel Corp.
英文描述： PowerPC 7457 RISC Microprocessor
中文描述： 7457的PowerPC RISC微處理器
文件頁數(shù)： 15/66頁
文件大小： 522K
代理商： PC7457
15
PC7457/47 [Preliminary]
5345B–HIREL–02/04
Thermal Management
Information
This section provides thermal management information for the ceramic ball grid array
(CBGA) package for air-cooled applications. Proper thermal control design is primarily
dependent on the system-level design – the heat sink, airflow, and thermal interface
material. To reduce the die-junction temperature, heat sinks may be attached to the
package by several methods – spring clip to holes in the printed-circuit board or pack-
age, and mounting clip and screw assembly (see Figure 32 on page 55); however, due
to the potential large mass of the heat sink, attachment through the printed-circuit board
is suggested. If a spring clip is used, the spring force should not exceed 10 pounds.
Figure 5.
Package Exploded Cross-sectional View with Several Heat Sink Options
Printed-Circuit Board
Thermal Interface
Material
Heat Sink
Clip
Heat Sink
CBGA Package
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
PC7457MGH933NC 制造商:e2v technologies 功能描述:MPU MPC74XX RISC 64BIT 0.13UM 933MHZ 1.5V/1.8V/2.5V 483HITCE - Trays
PC7457MGU1000L 制造商:ATMEL 制造商全稱:ATMEL Corporation 功能描述:PowerPC 7457 RISC Microprocessor
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PC7457MGU1200L 制造商:ATMEL 制造商全稱:ATMEL Corporation 功能描述:PowerPC 7457 RISC Microprocessor
PC7457MGU1200N 制造商:ATMEL 制造商全稱:ATMEL Corporation 功能描述:PowerPC 7457 RISC Microprocessor
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