參數(shù)資料
型號： PC7457MGU1200L
廠商： Atmel Corp.
英文描述： PowerPC 7457 RISC Microprocessor
中文描述： 7457的PowerPC RISC微處理器
文件頁數(shù)： 55/66頁
文件大?。?/td> 522K
代理商： PC7457MGU1200L
55
PC7457/47 [Preliminary]
5345B–HIREL–02/04
Connection
Recommendations
To ensure reliable operation, it is highly recommended to connect unused inputs to an
appropriate signal level. Unused active low inputs should be tied to OV
DD
. Unused
active high inputs should be connected to GND. All NC (no-connect) signals must
remain unconnected. Power and ground connections must be made to all external V
DD
,
OV
DD
, GV
DD
, and GND pins in the PC7457. If the L3 interface is not used, GV
DD
should
be connected to the OV
DD
power plane, and L3VSEL should be connected to BVSEL;
the remainder of the L3 interface may be left unterminated.
Output Buffer DC
Impedance
The PC7457 processor bus and L3 I/O drivers are characterized over process, voltage,
and temperature.
To measure Z0, an external resistor is connected from the chip pad to OV
DD
or GND.
Then, the value of each resistor is varied until the pad voltage is OV
DD
/2 (see Figure 30
on page 50).
The output impedance is the average of two components, the resistances of the pull-up
and pull-down devices. When data is held low, SW2 is closed (SW1 is open), and RN is
trimmed until the voltage at the pad equals OV
DD
/2. RN then becomes the resistance of
the pull-down devices. When data is held high, SW1 is closed (SW2 is open), and RP is
trimmed until the voltage at the pad equals OV
DD
/2. RP then becomes the resistance of
the pull-up devices. RP and RN are designed to be close to each other in value. Then,
Z0 = (RP + RN)/2.
Figure 32.
Driver Impedance Measurement
Table 20 summarizes the signal impedance results. The impedance increases with junc-
tion temperature and is relatively unaffected by bus voltage.
Table 20.
Impedance Characteristics with V
DD
= 1.5V, OV
DD
= 1.8V ±5%, T
j
= 5
°
- 85
°
C
Impedance
Processor bus
L3 Bus
Unit
Z
0
Typical
33 – 42
34 – 42
Maximum
31 – 51
32 – 44
OV
DD
OGND
SW2
SW1
RN
RP
Pad
Data
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