參數(shù)資料
型號： PC745BMZFU400LD
英文描述： MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|PLASTIC
中文描述： 微處理器| 32位|的CMOS | BGA封裝| 255PIN |塑料
文件頁數(shù)： 21/48頁
文件大?。?/td> 276K
代理商： PC745BMZFU400LD
PC755B/745B
21/48
A thermal interface material is recommended at the package lid-to-heat sink interface to minimize the thermal contact resistance. For
those applications where the heat sink is attached by spring clip mechanism, Figure 8 shows the thermal performance of three thin-
sheet thermal-interface materials (silicone, graphite/oil, floroether oil), a bare joint, and a joint with thermal grease as a function of
contact pressure. As shown, the performance of these thermal interface materials improves with increasing contact pressure. The
use of thermal grease significantly reduces the interface thermal resistance. That is, the bare joint results in a thermal resistance
approximately 7 times greater than the thermal grease joint.
Heat sinks are attached to the package by means of a spring clip to holes in the printed-circuit board (see Figure 7 ). This spring force
should not exceed 5.5 pounds of force. Therefore, the synthetic grease offers the best thermal performance, considering the low
interface pressure.
The board designer can choose between several types of thermal interface. Heat sink adhesive materials should be selected based
upon high conductivity, yet adequate mechanical strength to meet equipment shock/vibration requirements.
3.4.3.2. Heat Sink Selection Example
For preliminary heat sink sizing, the die-junction temperature can be expressed as follows:
T
j
= T
a
+ T
r
+ (
θ
jc
+
θ
int
+
θ
sa
) * P
d
Where
:
T
j
is the die-junction temperature
T
a
is the inlet cabinet ambient temperature
T
r
is the air temperature rise within the computer cabinet
θ
jc
is the junction-to-case thermal resistance
θ
int
is the adhesive or interface material thermal resistance
θ
sa
is the heat sink base-to-ambient thermal resistance
P
d
is the power dissipated by the device
During operation the die-junction temperatures (T
j
) should be maintained less than the value specified in Table 5. The temperature of
the air cooling the component greatly depends upon the ambient inlet air temperature and the air temperature rise within the electronic
cabinet. An electronic cabinet inlet-air temperature (T
a
) may range from 30 to 40
o
C. The air temperature rise within a cabinet (T
r
) may
be in the range of 5 to 10
o
C. The thermal resistance of the thermal interface material (
θ
int
) is typically about 1 C/W. Assuming a T
a
of 30
o
C, a T
r
of 5
o
C, a CBGA package
θ
jc
= 0.03, and a power consumption (P
d
) of 5.0 watts, the following expression for T
j
is obtained:
Die-junction temperature: T
j
= 30
o
C + 5
o
C + (0.03
o
C/W + 1.0
o
C/W +
θ
sa
) * 5.0 W
For a Thermalloy heat sink #2328B, the heat sink-to-ambient thermal resistance (
θ
sa
) versus airflow velocity is shown in Figure 9.
8
1
3
5
7
0
0.5
1
1.5
2
2.5
3
3.5
Thermalloy #2328B Pin–fin Heat Sink
(25 x28 x 15 mm)
Approach Air Velocity (m/s)
2
4
6
H
C
Figure 9 : Thermalloy #2328B Heat Sink-to-Ambient Thermal Resistance Versus Airflow Velocity
相關(guān)PDF資料
PDF描述
PC745BVZFU300LD MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|PLASTIC
PC745BVZFU350LD MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|PLASTIC
PC745BVZFU400LD MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|PLASTIC
PC755BMZFU300LD MICROPROCESSOR|32-BIT|CMOS|BGA|360PIN|PLASTIC
PC755BMZFU350LD MICROPROCESSOR|32-BIT|CMOS|BGA|360PIN|PLASTIC
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
PC745BVGH300LE 制造商:e2v technologies 功能描述:MPU RISC 32BIT 0.22UM 300MHZ 2.5V/3.3V 255HITCE CBGA - Trays
PC745BVGH350LE 制造商:e2v technologies 功能描述:PC745BVGH350LE - Trays
PC745BVZFU300LD 制造商:未知廠家 制造商全稱:未知廠家 功能描述:MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|PLASTIC
PC745BVZFU350LD 制造商:未知廠家 制造商全稱:未知廠家 功能描述:MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|PLASTIC
PC745BVZFU400LD 制造商:未知廠家 制造商全稱:未知廠家 功能描述:MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|PLASTIC
發(fā)布緊急采購，3分鐘左右您將得到回復。

采購需求

(若只采購一條型號，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

*型號 *數(shù)量 廠商 批號 封裝
添加更多采購

我的聯(lián)系方式

*
*
*