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| 型號(hào)： | PCA153XSERIES |
| 英文描述： | Clock Circuit |
| 中文描述： | 時(shí)鐘電路 |
| 文件頁數(shù)： | 7/12頁 |
| 文件大?。?/td> | 44K |
| 代理商： | PCA153XSERIES |
January 1994
7
Philips Semiconductors
Product specification
32 kHz clock circuit
PCA153X series
CHIP DIMENSIONS AND BONDING PAD LOCATIONS
Chip area: 1.20
μ
m
2
.
Bonding pad dimensions: 120
μ
m x 120
μ
m.
Fig.5 Bonding pad locations; 7 pins.
MGA936
0
0
1.20 mm
VDD
M1
M2
OSC OUT
VSS
TEST IN
OSC IN
y
x
1.00 mm
PCA153X
SERIES
Bonding pad locations (dimensions in
μ
m).
All x/y coordinates are referenced to bottom left pad (M1),
see Fig.5.
PAD
x
y
OSC OUT
V
TEST IN
M1
M2
V
DD
OSC IN
chip corner
(max. value)
0
0
0
0
880
670
380
0
675
675
675
94
575
785
180
180
APPLICATION INFORMATION
Fig.6 Typical application circuit diagram.
MGA934
VDD
n.c.
M2
TEST IN
VSS
OSC OUT
OSC IN
M1
M
1.4 V
PCA153X
SERIES
1
2
3
4
8
7
6
5
32 kHz
CT
5 pF to 25 pF
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