- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄3772 > PCA8575DB,118 (NXP Semiconductors)IC I/O EXPANDER I2C 16B 24SSOP PDF資料下載
參數(shù)資料
| 型號： | PCA8575DB,118 |
| 廠商： | NXP Semiconductors |
| 文件頁數(shù)： | 19/30頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC I/O EXPANDER I2C 16B 24SSOP |
| 特色產(chǎn)品： | NXP - I2C Interface |
| 標準包裝： | 1 |
| 接口： | I²C |
| 輸入/輸出數(shù)： | 16 |
| 中斷輸出： | 是 |
| 頻率 - 時鐘： | 400kHz |
| 電源電壓： | 2.3 V ~ 5.5 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 24-SSOP（0.209"，5.30mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 24-SSOP |
| 包裝： | 標準包裝 |
| 包括： | POR |
| 其它名稱： | 568-8702-6 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁當前第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁
PCA8575_2
NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 — 21 March 2007
26 of 30
NXP Semiconductors
PCA8575
Remote 16-bit I/O expander for I2C-bus with interrupt
Process issues, such as application of adhesive and ux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specications, including temperature and impurities
16.4 Reow soldering
Key characteristics in reow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reow process usually leads to
higher minimum peak temperatures (see Figure 28) than a PbSn process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reow temperature prole; this prole includes preheat, reow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classied in accordance with
Table 7 and 8
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reow
soldering, see Figure 28.
Table 7.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
Table 8.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| ATTINY88-15MZ | IC MCU AVR 8B 8KB FLASH 32QFN |
| PCA9535CD,118 | IC I/O EXPANDER I2C 16B 24SOIC |
| PCA9674APW,118 | IC I/O EXPANDER I2C 8B 16TSSOP |
| PCA9672PW,112 | IC I/O EXPANDER I2C 8B 16TSSOP |
| PCA9574PW,112 | IC I/O EXPANDER I2C 8B 16TSSOP |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PCA8575DB-T | 功能描述:接口-I/O擴展器 16-BIT I2C FM QB GPIO INT PU RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel |
| PCA8575DK | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Remote 16-bit I/O expander for I2C-bus with interrupt |
| PCA8575DK,118 | 功能描述:接口-I/O擴展器 16-BIT I2C FM QB RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel |
| PCA8575DK-T | 功能描述:接口-I/O擴展器 16-BIT I2C FM QB GPIO INT PU RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel |
| PCA8575PW | 功能描述:接口-I/O擴展器 16-BIT I2C FM QB GPIO INT PU RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。