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參數(shù)資料
型號(hào)： PCA9501D,112
廠商： NXP Semiconductors
文件頁(yè)數(shù)： 16/28頁(yè)
文件大小： 0K
描述： IC I/O EXPANDER I2C 8B 20SOIC
標(biāo)準(zhǔn)包裝： 38
接口： I²C，SM 總線
輸入/輸出數(shù)： 8
中斷輸出： 是
頻率 - 時(shí)鐘： 400kHz
電源電壓： 2.5 V ~ 3.6 V
工作溫度： -40°C ~ 85°C
安裝類型： 表面貼裝
封裝/外殼： 20-SOIC（0.295"，7.50mm 寬）
供應(yīng)商設(shè)備封裝： 20-SO
包裝： 管件
包括： EEPROM
配用： 568-4002-ND - DEMO BOARD I2C
其它名稱： 568-3353-5
935272364112
PCA9501D
PCA9501_4
NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 10 February 2009
23 of 28
NXP Semiconductors
PCA9501
8-bit I2C-bus and SMBus I/O port with interrupt, 2-kbit EEPROM
14.4 Reow soldering
Key characteristics in reow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reow process usually leads to
higher minimum peak temperatures (see Figure 29) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reow temperature prole; this prole includes preheat, reow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classied in accordance with
Table 8 and 9
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reow
soldering, see Figure 29.
Table 8.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
Table 9.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
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