參數(shù)資料
型號: PCA9515AD
廠商: NXP Semiconductors N.V.
元件分類: I2C/I2S
英文描述: I2C-bus repeater
封裝: PCA9515AD<SOT96-1 (SO8)|<<http://www.nxp.com/packages/SOT96-1.html<1<week 5, 2005,;PCA9515AD<SOT96-1 (SO8)|<<http://www.nxp.com/packages/SOT96-1.html<1<week 5, 2005
文件頁數(shù): 14/18頁
文件大?。?/td> 104K
代理商: PCA9515AD
PCA9515A_4
NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 04 — 11 April 2008
14 of 18
NXP Semiconductors
PCA9515A
I
2
C-bus repeater
13.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
Figure 11
) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 8
and
9
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Figure 11
.
Table 8.
Package thickness (mm)
SnPb eutectic process (from J-STD-020C)
Package reflow temperature (
°
C)
Volume (mm
3
)
< 350
235
220
350
220
220
< 2.5
2.5
Table 9.
Package thickness (mm)
Lead-free process (from J-STD-020C)
Package reflow temperature (
°
C)
Volume (mm
3
)
< 350
260
260
250
350 to 2000
260
250
245
> 2000
260
245
245
< 1.6
1.6 to 2.5
> 2.5
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