參數(shù)資料
型號(hào)： PCA9538PW,118
廠商： NXP Semiconductors
文件頁(yè)數(shù)： 18/34頁(yè)
文件大?。?/td> 0K
描述： IC I/O EXPANDER I2C 8B 16TSSOP
產(chǎn)品培訓(xùn)模塊： I²C Bus Fundamentals
特色產(chǎn)品： NXP - I2C Interface
標(biāo)準(zhǔn)包裝： 1
接口： I²C，SM 總線
輸入/輸出數(shù)： 8
中斷輸出： 是
頻率 - 時(shí)鐘： 400kHz
電源電壓： 2.3 V ~ 5.5 V
工作溫度： -40°C ~ 85°C
安裝類(lèi)型： 表面貼裝
封裝/外殼： 16-TSSOP（0.173"，4.40mm 寬）
供應(yīng)商設(shè)備封裝： 16-TSSOP
包裝： 標(biāo)準(zhǔn)包裝
包括： POR
產(chǎn)品目錄頁(yè)面： 825 (CN2011-ZH PDF)
配用： 568-3615-ND - DEMO BOARD I2C
其它名稱： 568-1840-6
PCA9538
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 6 — 6 February 2013
25 of 34
NXP Semiconductors
PCA9538
8-bit I2C-bus and SMBus low power I/O port with interrupt and reset
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
14.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 24) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 14 and 15
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 24.
Table 14.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (
C)
Volume (mm3)
< 350
350
< 2.5
235
220
2.5
220
Table 15.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (
C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
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參數(shù)描述
PCA9538PWG4 功能描述:接口-I/O擴(kuò)展器 Rem 8B I2C & SMBus Lo-Pwr I/O Expander RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel
PCA9538PWR 功能描述:接口-I/O擴(kuò)展器 Rem 8B I2C & SMBus Lo-Pwr I/O Expander RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel
PCA9538PWR 制造商:Texas Instruments 功能描述:IC I/O EXPANDER 8BIT 400KHZ TSSOP-16
PCA9538PWRG4 功能描述:接口-I/O擴(kuò)展器 Rem 8B I2C & SMBus Lo-Pwr I/O Expander RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel
PCA9538RGTR 制造商:TI 制造商全稱:Texas Instruments 功能描述:REMOTE 8-BIT I2C AND SMBus LOW-POWER I/O EXPANDER WITH INTERRUPT OUTPUT, RESET, AND CONFIGURATION REGISTERS
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