參數(shù)資料
型號： PCA9539BS,118
廠商： NXP Semiconductors
文件頁數(shù)： 21/37頁
文件大?。?/td> 0K
描述： IC I/O EXPANDER I2C 16B 24HVQFN
產(chǎn)品培訓(xùn)模塊： I²C Bus Fundamentals
特色產(chǎn)品： NXP - I2C Interface
標(biāo)準(zhǔn)包裝： 1
接口： I²C，SM 總線
輸入/輸出數(shù)： 16
中斷輸出： 是
頻率 - 時(shí)鐘： 400kHz
電源電壓： 2.3 V ~ 5.5 V
工作溫度： -40°C ~ 85°C
安裝類型： 表面貼裝
封裝/外殼： 24-VFQFN 裸露焊盤
供應(yīng)商設(shè)備封裝： 24-HVQFN（4x4）
包裝： 標(biāo)準(zhǔn)包裝
包括： POR
產(chǎn)品目錄頁面： 825 (CN2011-ZH PDF)
其它名稱： 568-1841-6
PCA9539_PCA9539R
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 6 — 6 February 2013
28 of 37
NXP Semiconductors
PCA9539; PCA9539R
16-bit I2C-bus and SMBus low power I/O port with interrupt and reset
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
15.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 30) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 18 and 19
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 30.
Table 18.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (
C)
Volume (mm3)
< 350
350
< 2.5
235
220
2.5
220
Table 19.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (
C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
PCA9539BSHP 功能描述:I/O Expander 16 I2C 400kHz 24-HVQFN (4x4) 制造商:nxp semiconductors 系列:- 包裝:剪切帶（CT） 零件狀態(tài):停產(chǎn) I/O 數(shù):16 接口:I2C 中斷輸出:是 特性:POR 輸出類型:開路漏極 電流 - 灌/拉輸出:50mA 頻率 - 時(shí)鐘:400kHz 電壓 - 電源:2.3 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:24-VFQFN 裸露焊盤 供應(yīng)商器件封裝:24-HVQFN（4x4） 標(biāo)準(zhǔn)包裝:1
PCA9539BS-T 制造商:NXP Semiconductors 功能描述:I2C/SMBus GPIO Expander 5.5V 24-Pin HVQFN EP T/R
PCA9539D 功能描述:接口-I/O擴(kuò)展器 I2C/SMBUS 16BIT GPIO RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel
PCA9539D,112 功能描述:接口-I/O擴(kuò)展器 I2C/SMBUS 16BIT GPIO RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel
PCA9539D,118 功能描述:接口-I/O擴(kuò)展器 16-BIT I2C FM TP GPIO INT RST RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel
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