參數(shù)資料
型號(hào): PCA9539D,118
廠商: NXP Semiconductors
文件頁數(shù): 9/37頁
文件大小: 0K
描述: IC I/O EXPANDER I2C 16B 24SOIC
產(chǎn)品培訓(xùn)模塊: I²C Bus Fundamentals
特色產(chǎn)品: NXP - I2C Interface
標(biāo)準(zhǔn)包裝: 1
接口: I²C,SM 總線
輸入/輸出數(shù): 16
中斷輸出:
頻率 - 時(shí)鐘: 400kHz
電源電壓: 2.3 V ~ 5.5 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 24-SOIC(0.295",7.50mm 寬)
供應(yīng)商設(shè)備封裝: 24-SO
包裝: 標(biāo)準(zhǔn)包裝
包括: POR
產(chǎn)品目錄頁面: 825 (CN2011-ZH PDF)
其它名稱: 568-1842-6
PCA9539_PCA9539R
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 6 — 6 February 2013
17 of 37
NXP Semiconductors
PCA9539; PCA9539R
16-bit I2C-bus and SMBus low power I/O port with interrupt and reset
8.1 Minimizing IDD when the I/Os are used to control LEDs
When the I/Os are used to control LEDs, they are normally connected to VDD through a
resistor as shown in Figure 16. Since the LED acts as a diode, when the LED is off the I/O
VI is about 1.2 V less than VDD. The supply current, IDD, increases as VI becomes lower
than VDD.
Designs needing to minimize current consumption, such as battery power applications,
should consider maintaining the I/O pins greater than or equal to VDD when the LED is off.
Figure 17 shows a high value resistor in parallel with the LED. Figure 18 shows VDD less
than the LED supply voltage by at least 1.2 V. Both of these methods maintain the I/O VI
at or above VDD and prevents additional supply current consumption when the LED is off.
9.
Limiting values
Fig 17. High value resistor in parallel with
the LED
Fig 18. Device supplied by a lower voltage
002aac189
LED
VDD
LEDn
100 k
Ω
VDD
002aac190
LED
VDD
LEDn
3.3 V
5 V
Table 13.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VDD
supply voltage
0.5
+6.0
V
VI/O
voltage on an input/output pin
VSS 0.5 6
V
IO
output current
on an I/O pin
-
50
mA
II
input current
-
20
mA
IDD
supply current
-
160
mA
ISS
ground supply current
-
200
mA
Ptot
total power dissipation
-
200
mW
Tstg
storage temperature
65
+150
C
Tamb
ambient temperature
operating
all devices except PCA9539PW/Q900
40
+85
C
PCA9539PW/Q900
40
+125
C
Tj(max)
maximum junction temperature
-
125
C
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