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參數(shù)資料
型號： PCA9555DB,118
廠商： NXP Semiconductors
文件頁數(shù)： 22/34頁
文件大?。?/td> 0K
描述： IC I/O EXPANDER I2C 16B 24SSOP
產(chǎn)品培訓(xùn)模塊： I²C Bus Fundamentals
特色產(chǎn)品： NXP - I2C Interface
標(biāo)準(zhǔn)包裝： 1
接口： I²C，SM 總線
輸入/輸出數(shù)： 16
中斷輸出： 是
頻率 - 時鐘： 400kHz
電源電壓： 2.3 V ~ 5.5 V
工作溫度： -40°C ~ 85°C
安裝類型： 表面貼裝
封裝/外殼： 24-SSOP（0.209"，5.30mm 寬）
供應(yīng)商設(shè)備封裝： 24-SSOP
包裝： 標(biāo)準(zhǔn)包裝
包括： POR
產(chǎn)品目錄頁面： 826 (CN2011-ZH PDF)
配用： 568-4002-ND - DEMO BOARD I2C
其它名稱： 568-1057-6
PCA9555_8
NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 08 — 22 October 2009
29 of 34
NXP Semiconductors
PCA9555
16-bit I2C-bus and SMBus I/O port with interrupt
Process issues, such as application of adhesive and ux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specications, including temperature and impurities
15.4 Reow soldering
Key characteristics in reow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reow process usually leads to
higher minimum peak temperatures (see Figure 32) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reow temperature prole; this prole includes preheat, reow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classied in accordance with
Table 16 and 17
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reow
soldering, see Figure 32.
Table 16.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
Table 17.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
PCA9555DBG4 功能描述:接口-I/O擴(kuò)展器 Rem 16B I2C & SMBus I/O Expander RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel
PCA9555DBQR 功能描述:接口-I/O擴(kuò)展器 Remote 16-Bit I2C & SMBus I/O Expander RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel
PCA9555DBQRG4 功能描述:接口-I/O擴(kuò)展器 Remote 16-Bit I2C & SMBus I/O Expander RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel
PCA9555DBR 功能描述:接口-I/O擴(kuò)展器 Remote 16-Bit I2C & SMBus I/O Expander RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel
PCA9555DBRG4 功能描述:接口-I/O擴(kuò)展器 Rem 16B I2C & SMBus I/O Expander RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel
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