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參數(shù)資料
| 型號(hào)： | PCA9555PW,112 |
| 廠商： | NXP Semiconductors |
| 文件頁數(shù)： | 24/34頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC I/O EXPANDER I2C 16B 24TSSOP |
| 產(chǎn)品培訓(xùn)模塊： | I²C Bus Fundamentals |
| 特色產(chǎn)品： | NXP - I2C Interface |
| 標(biāo)準(zhǔn)包裝： | 63 |
| 接口： | I²C，SM 總線 |
| 輸入/輸出數(shù)： | 16 |
| 中斷輸出： | 是 |
| 頻率 - 時(shí)鐘： | 400kHz |
| 電源電壓： | 2.3 V ~ 5.5 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 24-TSSOP（0.173"，4.40mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 24-TSSOP |
| 包裝： | 管件 |
| 包括： | POR |
| 產(chǎn)品目錄頁面： | 826 (CN2011-ZH PDF) |
| 配用： | 568-4002-ND - DEMO BOARD I2C |
| 其它名稱： | 568-3986-5 935269569112 PCA9555PW PCA9555PW-ND |
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PCA9555_8
NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 08 — 22 October 2009
30 of 34
NXP Semiconductors
PCA9555
16-bit I2C-bus and SMBus I/O port with interrupt
For further information on temperature proles, refer to Application Note
AN10365
“Surface mount reow soldering description”.
16. Soldering of through-hole mount packages
16.1 Introduction to soldering through-hole mount packages
This text gives a very brief insight into wave, dip and manual soldering.
Wave soldering is the preferred method for mounting of through-hole mount IC packages
on a printed-circuit board.
16.2 Soldering by dipping or by solder wave
Driven by legislation and environmental forces the worldwide use of lead-free solder
pastes is increasing. Typical dwell time of the leads in the wave ranges from
3 seconds to 4 seconds at 250
°C or 265 °C, depending on solder material applied, SnPb
or Pb-free respectively.
The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic
body must not exceed the specied maximum storage temperature (Tstg(max)). If the
printed-circuit board has been pre-heated, forced cooling may be necessary immediately
after soldering to keep the temperature within the permissible limit.
16.3 Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is
less than 300
°C it may remain in contact for up to 10 seconds. If the bit temperature is
between 300
°C and 400 °C, contact may be up to 5 seconds.
MSL: Moisture Sensitivity Level
Fig 32. Temperature proles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PCA9555PW118 | 制造商:NXP Semiconductors 功能描述:IC I/O EXPANDER 16BIT 24TSSOP |
| PCA9555PW118 | 制造商:NXP Semiconductors 功能描述:IC I/O EXPANDER 16BIT 400KHZ TSSOP24 |
| PCA9555PWE4 | 功能描述:接口-I/O擴(kuò)展器 Remote 16-Bit I2C & SMBus I/O Expander RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel |
| PCA9555PWG4 | 功能描述:接口-I/O擴(kuò)展器 Rem 16B I2C & SMBus I/O Expander RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel |
| PCA9555PWR | 功能描述:接口-I/O擴(kuò)展器 Remote 16-Bit I2C & SMBus I/O Expander RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel |
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