參數(shù)資料
型號(hào)： PCA9557PW,112
廠商： NXP Semiconductors
文件頁(yè)數(shù)： 15/30頁(yè)
文件大小： 0K
描述： IC I/O EXPANDER I2C 8B 16TSSOP
標(biāo)準(zhǔn)包裝： 96
接口： I²C，SM 總線
輸入/輸出數(shù)： 8
中斷輸出： 無(wú)
頻率 - 時(shí)鐘： 400kHz
電源電壓： 2.3 V ~ 5.5 V
工作溫度： -40°C ~ 85°C
安裝類(lèi)型： 表面貼裝
封裝/外殼： 16-TSSOP（0.173"，4.40mm 寬）
供應(yīng)商設(shè)備封裝： 16-TSSOP
包裝： 管件
包括： POR
產(chǎn)品目錄頁(yè)面： 826 (CN2011-ZH PDF)
其它名稱： 568-5028
935270669112
PCA9557PW
PCA9557PW,112-ND
PCA9557PW-ND
PCA9557
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 7 — 10 December 2013
22 of 30
NXP Semiconductors
PCA9557
8-bit I2C-bus and SMBus I/O port with reset
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
15.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 26) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 26.
Table 12.
SnPb eutectic process (from J-STD-020D)
Package thickness (mm)
Package reflow temperature (
C)
Volume (mm3)
< 350
350
< 2.5
235
220
2.5
220
Table 13.
Lead-free process (from J-STD-020D)
Package thickness (mm)
Package reflow temperature (
C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
PCA9557PW112 制造商:NXP Semiconductors 功能描述:IC I/O EXPANDER 8BIT 400KHZ TSSOP-16
PCA9557PW118 制造商:NXP Semiconductors 功能描述:IC I/O EXPANDER 8BIT 400KHZ TSSOP-16
PCA9557PWG4 功能描述:接口-I/O擴(kuò)展器 Rem 8B I2C & SMBus Low-Pwr I/O Expander RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel
PCA9557PWR 功能描述:接口-I/O擴(kuò)展器 Remote 8B I2C & SMBus I/O Expander RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel
PCA9557PWRG4 功能描述:接口-I/O擴(kuò)展器 Rem 8B I2C & SMBus Low-Pwr I/O Expander RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel
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