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參數(shù)資料
| 型號： | PCA9575HF,118 |
| 廠商： | NXP Semiconductors |
| 文件頁數(shù)： | 28/38頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC I/O EXPANDER I2C 16B 24HWQFN |
| 產(chǎn)品培訓模塊： | I²C Bus Fundamentals |
| 特色產(chǎn)品： | NXP - I2C Interface |
| 標準包裝： | 1 |
| 接口： | I²C，SM 總線 |
| 輸入/輸出數(shù)： | 16 |
| 中斷輸出： | 是 |
| 頻率 - 時鐘： | 400kHz |
| 電源電壓： | 1.1 V ~ 3.6 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 24-WFQFN 裸露焊盤 |
| 供應商設(shè)備封裝： | 24-HWQFN（4x4） |
| 包裝： | 標準包裝 |
| 包括： | POR |
| 產(chǎn)品目錄頁面： | 826 (CN2011-ZH PDF) |
| 其它名稱： | 568-4771-6 |
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PCA9575_3
NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 — 9 November 2009
34 of 38
NXP Semiconductors
PCA9575
16-bit I2C-bus and SMBus, level translating, low voltage GPIO
Process issues, such as application of adhesive and ux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specications, including temperature and impurities
17.4 Reow soldering
Key characteristics in reow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reow process usually leads to
higher minimum peak temperatures (see Figure 28) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reow temperature prole; this prole includes preheat, reow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classied in accordance with
Table 23 and 24
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reow
soldering, see Figure 28.
Table 23.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
Table 24.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PCA9575PW1,118 | 功能描述:I2C 接口集成電路 I2C Bus/ SMBus Level Translating 24-Pin RoHS:否 制造商:NXP Semiconductors 電源電壓-最大:5.5 V 電源電壓-最小:2.3 V 最大工作頻率:400 KHz 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-16 |
| PCA9575PW2,118 | 功能描述:I2C 接口集成電路 I2C Bus/ SMBus Level Translating 28-Pin RoHS:否 制造商:NXP Semiconductors 電源電壓-最大:5.5 V 電源電壓-最小:2.3 V 最大工作頻率:400 KHz 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-16 |
| PCA9575PW2118 | 制造商:Rochester Electronics LLC 功能描述: 制造商:NXP 功能描述: 制造商:NXP Semiconductors 功能描述: |
| PCA9600D | 功能描述:緩沖器和線路驅(qū)動器 FM+ BUS BUFFER RoHS:否 制造商:Micrel 輸入線路數(shù)量:1 輸出線路數(shù)量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel |
| PCA9600D,112 | 功能描述:緩沖器和線路驅(qū)動器 FM+ BUS BUFFER RoHS:否 制造商:Micrel 輸入線路數(shù)量:1 輸出線路數(shù)量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel |
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