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參數資料
| 型號： | PCA9675DK |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | Remote 16-bit I/O expander for Fm+ I2C-bus with interrupt |
| 中文描述： | 18 I/O, PIA-GENERAL PURPOSE, PDSO24 |
| 封裝： | 3.90 MM, 0.635 MM PITCH, PLASTIC, MO-137, SOT556-1, SSOP-24 |
| 文件頁數： | 30/34頁 |
| 文件大?。?/td> | 185K |
| 代理商： | PCA9675DK |
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PCA9675_1
NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 — 1 February 2007
30 of 34
NXP Semiconductors
PCA9675
Remote 16-bit I/O expander for Fm+ I
2
C-bus with interrupt
15. Handling information
Inputs and outputs are protected against electrostatic discharge in normal handling.
However, to be completely safe you must take normal precautions appropriate to handling
integrated circuits.
16. Soldering
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”
16.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
16.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
Through-hole components
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus PbSn soldering
16.3 Wave soldering
Key characteristics in wave soldering are:
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相關代理商/技術參數 |
參數描述 |
|---|---|
| PCA9675DK,118 | 功能描述:接口-I/O擴展器 16-BIT I2C FM+ QB RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel |
| PCA9675DK-T | 功能描述:接口-I/O擴展器 16-BIT I2C FM+ QB GPIO RST PU RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel |
| PCA9675D-T | 功能描述:接口-I/O擴展器 16-BIT I2C FM+ QB GPIO RST PU RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel |
| PCA9675PW | 功能描述:接口-I/O擴展器 16-BIT I2C FM+ QB GPIO RST PU RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel |
| PCA9675PW,112 | 功能描述:接口-I/O擴展器 16-BIT I2C FM+ QB RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel |
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