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參數(shù)資料
| 型號(hào)： | PE077526-1041-0D |
| 廠(chǎng)商： | HON HAI PRECISION INDUSTRY CO LTD |
| 元件分類(lèi)： | 插座 |
| 英文描述： | BGA775, IC SOCKET |
| 封裝： | LEAD FREE |
| 文件頁(yè)數(shù)： | 1/1頁(yè) |
| 文件大?。?/td> | 101K |
| 代理商： | PE077526-1041-0D |
All specification & dimensions are subject to change, please call your nearest Foxconn sales representative for update information.
14
SPECIFICATIONS
LGA/BGA 775(DT)
LG A/ BG A CP U S ock et
LG A SM T Typ e
1,09X 1.17mm[0.043 X.046”]
Pitch
775 P os.
Mechanical
Socket Engagement Force: 3.9kgf max.
Socket Disengagement Force: 1kgf max.
Durability: 20 Cycles min.
Solder Ball Shear Force: 500gf min.
Electrical
Final Averaged Contact Resistance
(average of minimum 12pin/chian): 15.2 m
max.
Final Max. Chain Contact Resistance: 28 m
max.
Insulation Resistance: 800m
min.
Dielectric Withstanding Voltage: 360 V RMS min.
Physical
Socket Body: Thermoplastic, UL 94V-0 rated, Black Color
PnP Cap: Thermoplastic, UL 94V-0 rated, Black Color
Load Plate: Stainless Steel
Stiffener: Stainless Steel
Load Lever: Stainless Steel
Contact: Copper Alloy
Plating: See “ORDERING INFORMATION”
DRAWING
RECOMMENDED P.C.B LAYOUT
ORDERING INFORMATION
Package
0=Hard Tray
Pick Up Cap Design
1=Removal Table Is Flat
Material / Color Of Insulator
4=Thermoplastic Black
Material Of Contact
1=Copper Alloy
Actual Loading Contact
0775=775 Contact
Termination Type:
2=Leaded Free BGA Type
Grid Array Type
10=33X30 With 15X14 Grid
Depopolation in the center
PRODUCT NO.: P E 0775 2 6- 10 4 1- 0 D
Gold Plating On
Contact Area
6=10u" Gold Plating On Contact Area
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