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參數(shù)資料
| 型號(hào)： | PESDXL2BT |
| 廠商： | NXP Semiconductors N.V. |
| 元件分類(lèi)： | 靜電保護(hù)器 |
| 英文描述： | Low capacitance double bidirectional ESD protection diodes in SOT23 |
| 中文描述： | SOT23封裝的低電容雙路雙向ESD保護(hù)二極管 |
| 文件頁(yè)數(shù)： | 10/14頁(yè) |
| 文件大?。?/td> | 179K |
| 代理商： | PESDXL2BT |
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9397 750 14034
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 — 1 November 2005
10 of 14
Philips Semiconductors
PESDxL2BT series
Low capacitance double bidirectional ESD protection diodes in SOT23
7.
Application information
The PESDxL2BT series is designed for the protection of two bidirectional signal lines from
the damage caused by ESD and surge pulses. The PESDxL2BT series may be used on
lines where the signal polarities are above and below ground. The PESDxL2BT series
provides a surge capability of up to 350 W per line for an 8/20
μ
s waveform.
Circuit board layout and protection device placement
Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT)
and surge transients. The following guidelines are recommended:
1. Place the PESDxL2BT as close to the input terminal or connector as possible.
2. The path length between the PESDxL2BT and the protected line should be
minimized.
3. Keep parallel signal paths to a minimum.
4. Avoid running protected conductors in parallel with unprotected conductors.
5. Minimize all Printed-Circuit Board (PCB) conductive loops including power and
ground loops.
6. Minimize the length of the transient return path to ground.
7. Avoid using shared transient return paths to a common ground point.
8. Ground planes should be used whenever possible. For multilayer PCBs, use ground
vias.
Fig 10. Application diagram
006aaa163
GND
PESDxL2BT
line 2 to be protected
line 1 to be protected
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