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參數(shù)資料
| 型號： | PG0155.102 |
| 廠商： | PULSE ELECTRONICS CORP |
| 元件分類： | 通用定值電感 |
| 英文描述： | 1 ELEMENT, 1 uH, GENERAL PURPOSE INDUCTOR, SMD |
| 文件頁數(shù)： | 2/2頁 |
| 文件大小： | 91K |
| 代理商： | PG0155.102 |
17
PC500.D (7/04)
US 858 674 8100 UK 44 1483 401 700 France 33 3 84 35 04 04 Singapore 65 6287 8998 Taiwan 886 2 2698 0228 Hong Kong 852 2788 6588 http://www.pulseeng.com
0.0
0.5
1.0
1.5
2.0
2.5
3.0
CURRENT(A)
INDUCT
ANCE(uH)
PG0155.331
PG0155.601
PG0155.102
1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
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49
51
53
55
Inductance vs Current Characteristics
Notes from Tables
1. The temperature of the component (ambient plus temperature
rise) must be within the standard operating temperature range.
2. Inductance at Irated is a typical inductance value for the
component taken at rated current.
3. The rated current listed is the lower of the saturation current
@ 25°C or the heating current.
4. The saturation current, Isat, is the current at which the
component inductance drops by 20% (typical) at an ambient
temperature of 25°C. This current is determined by placing the
component in the specified ambient environment and applying a
short duration pulse current (to eliminate self-heating effects) to
the component.
5. The heating current, IDC, is the DC current required to raise the
component temperature by approximately 40°C. The heating
current is determined by mounting the component on a typical
PCB and applying current for 30 minutes. The temperature is
measured by placing the thermocouple on top of the unit under
test. Take note that the component’s performance varies depend-
ing on the system condition. It is suggested that the component
be tested at the system level, to verify the temperature rise of the
component during system operation.
6. Core loss approximation is based on published core data:
Core Loss = K1 * (f)0.5539 * (K2
I)2.2355
Where: Core Loss = in Watts
f = switching frequency in kHz
K1 & K2 = core loss factors
I = delta I across the component in Ampere
K2
I = one half of the peak to peak flux density
across the component in Gauss
7. Unless otherwise specified, all testing is made at 100kHz, 0.1VAC.
8. Add suffix "T" to the part number for Tape & Reel packaging
(ex: PG0155.331T).
SMT POWER INDUCTORS
Flat Coils - PG0155 Series
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PG0155102NL | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:SMT POWER INDUCTORS |
| PG0155331NL | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:SMT POWER INDUCTORS |
| PG0155601NL | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:SMT POWER INDUCTORS |
| PG0155KIT | 功能描述:SHAPED CORE INDUCTOR KIT NPB 制造商:pulse electronics corporation 系列:* 零件狀態(tài):有效 標(biāo)準(zhǔn)包裝:1 |
| PG0155NL | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:SMT POWER INDUCTORS |
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