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參數(shù)資料
| 型號： | PG238RW1F |
| 元件分類： | 插座 |
| 英文描述： | PGA238, IC SOCKET |
| 文件頁數(shù)： | 1/2頁 |
| 文件大?。?/td> | 725K |
| 代理商： | PG238RW1F |
LIF PGA Series
BURNDY
Description
This
highly
accommodating
socket
is
designed with many valuable features. It is
constructed of high temperature, glass-filled
Thermoplastic so it will withstand both I.R.
and vapor phase solder reflow temperatures
and it has a UL rating of 94-VO.
To provide low insertion force with high
normal force characteristics this socket is
designed with. 012” (0,3) staggered contact
configuration. A typical 169 position seating
force is less than 40 pounds.
To accommodate Intel based microproces-
sors the sockets are available in 168, 169,
208, 237, 238 and 273 positions.
The socket’s industry-standard housing
configuration includes convenient installation
features :
- it occupies the same PCB area as the
Microprocessor
- installed socket height equals .280” (7.1)
maximum which allows .500” (12.7) of
spacing between PCBs
- a 75° conical lead-in assures superior micro-
processor pin guidance.
- the preloaded phosphor bronze contact
accepts .016 - .020” (0.41 - 0.51) diameter pins
- 60° tapered solder tail facilitates a smooth
entry into the PCB
- .120” (3.0) solder tail length accommodates
industry standard .0625” (1.59) thick PCBs
- the socket enlists dual beam contact
geometry by providing two large gold plated
surfaces for maximum contact wipe
The #1 pin locator is provided by a 45° outer
polarization chamfer while the 45° inner
polarization
chamfer
makes
the
socket
compatible with robotic assembly. Burndy tube
packaging also contributes to automatic
handling while providing superior pin protection.
The socket’s dimensions provide for optimal
microprocessor operation :
- .047” (1.19) Microprocessor standoffs and
the open bottom housing permit improved
air flow and cooling of microprocessors
- .032” (0.81) PCB standoff ensures proper
solder joint inspection along with easy
repairs and cleaning.
Characteristics
Electrical
Voltage Rating :
28 VAC at .5 amps max
Current Rating :
2 ampere with 30° rise over ambient
Contact Resistance :
- Initial
10 milliohms max
- Post Test
20 milliohms max
Capacitance :
2.0 pf max at 10 MgHz
Material
Housing :
- Glass filled,
High Temperature Thermoplastic
- UL Rating : UL94-VO
- Color : Black
Contacts : Copper Alloy
Finish
Contact Plating :
- Underplate :
50 microinches (1.27 microns) min nickel
- Mating area variations :
15 microinches (0.38 microns) min gold
10 microinches (0.25 microns) min
palladium/nickel with gold flash
25 microinches (0.63 microns) min
palladium/nickel with gold flash
(see plating type designation below)
- Solder Tail Area :
100 microinches (2.54 microns) min tin/lead
Environmental
Operating Temperature :
-40°F (-40°C) to +203°F (+95°C)
Mechanical
Durability : 25 cycles
Insertion Force :
3.0 oz (0.83N) Max Avg (.020 (0.51) Dia Pin)
Extraction Force :
0.53 oz (0.15N) Min Avg (.020 (0.51) Dia Pin)
Applications
PGA socket for all purposes
in electronic area
Standards
plating type
A - 15 microinches (0.38 microns) min gold,
100 microinches (2.54 microns) min tin/lead,
50 microinches (1.27 microns) min nickel.
E
- 10 microinches (0.25 microns) min palladium/nickel with gold flash,
100 microinches (2.54 microns) min tin/lead,
50 microinches (1.27 microns) min nickel.
F
- 25 microinches (0.63 microns) min palladium/nickel with gold flash,
100 microinches (2.54 microns) min tin/lead,
50 microinches (1.27 microns) min nickel.
design variations
solder tail lenght
W= .12 (3.0)
housing size
- N-R-T (see page 511)
N. of contacts positions
- 168, 169, 208, 237, 238, 273
PGA socket
PG
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1
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Ordering information
510
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