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參數(shù)資料
| 型號： | PIC12F1840-E/MF |
| 廠商： | Microchip Technology |
| 文件頁數(shù)： | 79/122頁 |
| 文件大?。?/td> | 0K |
| 描述： | MCU 7KB FLASH 256B RAM XLP 8DFN |
| 產(chǎn)品培訓(xùn)模塊： | 8-bit PIC® Microcontroller Portfolio |
| 標(biāo)準(zhǔn)包裝： | 120 |
| 系列： | PIC® XLP™ 12F |
| 核心處理器： | PIC |
| 芯體尺寸： | 8-位 |
| 速度： | 32MHz |
| 連通性： | I²C，LIN，SPI，UART/USART |
| 外圍設(shè)備： | 欠壓檢測/復(fù)位，POR，PWM，WDT |
| 輸入/輸出數(shù)： | 5 |
| 程序存儲器容量： | 7KB（4K x 14） |
| 程序存儲器類型： | 閃存 |
| EEPROM 大?。?/td> | 256 x 8 |
| RAM 容量： | 256 x 8 |
| 電壓 - 電源 (Vcc/Vdd)： | 2.3 V ~ 5.5 V |
| 數(shù)據(jù)轉(zhuǎn)換器： | A/D 4x10b |
| 振蕩器型： | 內(nèi)部 |
| 工作溫度： | -40°C ~ 125°C |
| 封裝/外殼： | 8-VDFN 裸露焊盤 |
| 包裝： | 管件 |
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PIC12(L)F1840
DS41441B-page 6
Preliminary
2011 Microchip Technology Inc.
Table of Contents
1.0
Device Overview .......................................................................................................................................................................... 9
2.0
Enhanced Mid-Range CPU ........................................................................................................................................................ 13
3.0
Memory Organization ................................................................................................................................................................. 15
4.0
Device Configuration .................................................................................................................................................................. 41
5.0
Oscillator Module (With Fail-Safe Clock Monitor)....................................................................................................................... 47
6.0
Reference Clock Module ............................................................................................................................................................ 57
7.0
Resets ........................................................................................................................................................................................ 69
8.0
Interrupts .................................................................................................................................................................................... 77
9.0
Power-Down Mode (Sleep) ........................................................................................................................................................ 89
10.0 Watchdog Timer (WDT) ............................................................................................................................................................. 93
11.0 Data EEPROM and Flash Program Memory Control ................................................................................................................. 97
12.0 I/O Ports ................................................................................................................................................................................... 111
13.0 Interrupt-on-Change ................................................................................................................................................................. 119
14.0 Fixed Voltage Reference (FVR) ............................................................................................................................................... 123
15.0 Temperature Indicator .............................................................................................................................................................. 125
16.0 Analog-to-Digital Converter (ADC) Module .............................................................................................................................. 127
17.0 Digital-to-Analog Converter (DAC) Module .............................................................................................................................. 141
18.0 SR Latch................................................................................................................................................................................... 145
19.0 Comparator Module.................................................................................................................................................................. 151
20.0 Timer0 Module ......................................................................................................................................................................... 159
21.0 Timer1 Module ......................................................................................................................................................................... 163
22.0 Timer2 Modules........................................................................................................................................................................ 175
23.0 Data Signal Modulator (DSM) .................................................................................................................................................. 179
24.0 Capture/Compare/PWM Module .............................................................................................................................................. 189
25.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 211
26.0 Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) ............................................................... 267
27.0 Capacitive Sensing (CPS) Module ........................................................................................................................................... 295
28.0 In-Circuit Serial Programming (ICSP) ................................................................................................................................ 303
29.0 Instruction Set Summary .......................................................................................................................................................... 307
30.0 Electrical Specifications............................................................................................................................................................ 321
31.0 DC and AC Characteristics Graphs and Tables....................................................................................................................... 355
32.0 Development Support............................................................................................................................................................... 357
33.0 Packaging Information.............................................................................................................................................................. 361
Appendix A: Revision History............................................................................................................................................................. 371
Appendix B: Device Differences......................................................................................................................................................... 371
Index .................................................................................................................................................................................................. 371
The Microchip Web Site ..................................................................................................................................................................... 379
Customer Change Notification Service .............................................................................................................................................. 379
Customer Support .............................................................................................................................................................................. 379
Reader Response .............................................................................................................................................................................. 380
Product Identification System............................................................................................................................................................. 381
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PIC12F1840-I/MF | 功能描述:8位微控制器 -MCU 7KB Flash EEPROM 256b nanoWatt RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時鐘頻率:50 MHz 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT |
| PIC12F1840-I/MF | 制造商:Microchip Technology Inc 功能描述:; Controller Family/Series:PIC12F; Core |
| PIC12F1840-I/P | 功能描述:8位微控制器 -MCU 7KB Flash EEPROM 256b nanoWatt RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時鐘頻率:50 MHz 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT |
| PIC12F1840-I/PC01 | 制造商:Microchip Technology Inc 功能描述: |
| PIC12F1840-I/SN | 功能描述:8位微控制器 -MCU 7KB Flash EEPROM 256b nanoWatt RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時鐘頻率:50 MHz 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT |
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