• <pre id="w3svd"><span id="w3svd"></span></pre><pre id="w3svd"></pre>
    • 參數(shù)資料
      型號(hào): PIC16C662T-04I/PQ
      廠商: Microchip Technology
      文件頁數(shù): 55/125頁
      文件大?。?/td> 0K
      描述: IC MCU OTP 4KX14 COMP 44-MQFP
      標(biāo)準(zhǔn)包裝: 900
      系列: PIC® 16C
      核心處理器: PIC
      芯體尺寸: 8-位
      速度: 4MHz
      外圍設(shè)備: 欠壓檢測(cè)/復(fù)位,LED,POR,WDT
      輸入/輸出數(shù): 33
      程序存儲(chǔ)器容量: 7KB(4K x 14)
      程序存儲(chǔ)器類型: OTP
      RAM 容量: 176 x 8
      電壓 - 電源 (Vcc/Vdd): 4 V ~ 6 V
      振蕩器型: 外部
      工作溫度: -40°C ~ 85°C
      封裝/外殼: 44-QFP
      包裝: 帶卷 (TR)
      Micrel, Inc.
      KSZ8862-16/32MQL
      April 2007
      35
      M9999-040407-3.0
      Signal
      Type
      (1)
      Function
      RDYRTNN
      I
      Ready Return
      For VLBus-like access: exactly like RDYRTNN signal in VLBus to end the cycle.
      For burst access: exactly like EXRDY signal in EISA to insert wait states. Note that the
      wait states are inserted by system logic (memory) not by KSZ8862M.
      BCLK
      I
      Bus Clock
      Asynchronous Transfer Signals
      RDN
      I
      Asynchronous Read
      WRN
      I
      Asynchronous Write
      ARDY
      O
      Asynchronous Ready
      This signal is asserted (low) to insert wait states.
      Table 2. Bus Interface Unit Signal Grouping
      Legend:
      I = Input.
      O = Output.
      I/O = Bi-directional.
      Regardless of whether the transfer is synchronous or asynchronous, if the address latch is required, use the rising edge of
      ADSN to latch the incoming signals A[15:1], AEN, BE3N, BE2N, BE1N, and BE0N.
      Note: Whether the transfer is synchronous or asynchronous, if the local device decoder is used, LDEVN will be asserted
      to indicate that the KSZ8862M is successfully targeted. Basically, signal LDEVN is a combinatorial decode of AEN and
      A[15:4].
      Asynchronous Interface
      For asynchronous transfers, the asynchronous dedicated signals RDN (for read) or WRN (for write) toggle, but the
      synchronous dedicated signals BCLK, CYCLEN, SWR, and RDYRTNN are de-asserted and stay at the same logic level
      throughout the entire asynchronous transfer.
      There is no data burst support for asynchronous transfer. All asynchronous transfers are single-data transfers. The BIU,
      however, provides flexible asynchronous interfacing to communicate with various applications and architectures. Three
      major ways of interfacing with the system (host) are.
      1.
      Interfacing with the system/host relying on local device decoding and having stable address throughout the whole
      transfer:
      The typical example for this application is ISA-like bus interface using latched address signals as shown in the Figure
      16. No additional address latch is required, therefore ADSN should be connected Low. The BIU decodes A[15:4] and
      qualifies with AEN (Address Enable) to determine if the KSZ8862M switch is the intended target. The host utilizes the
      rising edge of RDN to latch read data and the BIU will use rising edge of WRN to latch write data.
      2.
      Interfacing with the system/host relying on local device decoding but not having stable address throughout the entire
      transfer: the typical example for this application is EISA-like bus (non-burst) interface as shown in the Figure 17. This
      type of interface requires ADSN to latch the address on the rising edge. The BIU decodes latched A[15:4] and
      qualifies with AEN to determine if the KSZ8862M switch is the intended target. The data transfer is the same as the
      first case.
      3.
      Interfacing with the system/host relying on central decoding (KSZ8862-32 mode only).
      The typical example for this application is for an embedded processor having a central decoder on the system board
      or within the processor. Connecting the chip select (CS) from system/host to DATACSN bypasses the local device
      decoder. When the DATACSN is asserted, it only allows access to the Data Register in 32 bits and BE3N, BE2N,
      BE1N, and BE0N are ignored as shown in the Figure 18. No other registers can be accessed by asserting DATACSN.
      The data transfer is the same as in the first case, independent of the type of asynchronous interface used. To insert a
      wait state, the BIU will assert ARDY to prolong the cycle.
      相關(guān)PDF資料
      PDF描述
      PIC16C662T-04I/L IC MCU OTP 4KX14 COMP 44PLCC
      JBXFD2G10MCSDSMR CONN PLUG 10POS STR CABLE CRIMP
      PIC16C662T-04E/PT IC MCU OTP 4KX14 COMP 44TQFP
      PIC16C662T-04E/PQ IC MCU OTP 4KX14 COMP 44-MQFP
      VI-J34-IX-F3 CONVERTER MOD DC/DC 48V 75W
      相關(guān)代理商/技術(shù)參數(shù)
      參數(shù)描述
      PIC16C662T-10/L 功能描述:8位微控制器 -MCU 7KB 176 RAM 33 I/O RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT
      PIC16C662T-10/PQ 功能描述:8位微控制器 -MCU 7KB 176 RAM 33 I/O RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT
      PIC16C662T-10/PT 功能描述:8位微控制器 -MCU 7KB 176 RAM 33 I/O RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT
      PIC16C662T-10E/L 功能描述:8位微控制器 -MCU 7KB 176 RAM 33 I/O RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT
      PIC16C662T-10E/PQ 功能描述:8位微控制器 -MCU 7KB 176 RAM 33 I/O RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT