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PIC16C63A/65B/73B/74B
DS30605C-page 116
2000 Microchip Technology Inc.
16.1
DC Characteristics
PIC16LC63A/65B/73B/74B-04
Standard Operating Conditions (unless otherwise stated)
Operating temperature
0
°
C
≤
T
A
≤
-40
°
C
Standard Operating Conditions (unless otherwise stated)
Operating temperature
0
°
C
≤
T
A
≤
-40
°
C
-40
°
C
+70
°
C
+85
°
C
for commercial
for industrial
≤
T
A
≤
PIC16C63A/65B/73B/74B-04
PIC16C6A/65B/73B/74B-20
+70
°
C
+85
°
C
for commercial
for industrial
for extended
≤
T
A
≤
≤
T
A
≤
+125
°
C
Param
No.
Sym
Characteristic
Min
Typ
Max
Units
Conditions
V
DD
Supply Voltage
D001
PIC16LCXXX
2.5
V
BOR
*
–
–
5.5
5.5
V
V
LP, XT, RC osc modes (DC - 4 MHz)
BOR enabled
(Note 7)
D001
D001A
PIC16CXXX
4.0
4.5
V
BOR
*
–
–
–
–
5.5
5.5
5.5
–
V
V
V
V
XT, RC and LP osc mode
HS osc mode
BOR enabled
(Note 7)
D002*
V
DR
RAM Data Retention
Voltage
(Note 1)
1.5
D003
V
POR
V
DD
Start Voltage
to
ensure internal
Power-on Reset signal
–
V
SS
–
V
See section on Power-on Reset for details
D004*
D004A*
S
VDD
V
DD
Rise Rate
to
ensure internal
Power-on Reset signal
0.05
TBD
–
–
–
–
V/mS
V/mS
PWRT enabled (PWRTE bit clear)
PWRT disabled (PWRTE bit set)
See section on Power-on Reset for details
D005
V
BOR
Brown-out Reset
voltage trip point
* These parameters are characterized but not tested.
Data in
“
Typ
”
column is at 5V, 25
°
C unless otherwise stated. These parameters are for design guidance only and
are not tested.
When specification values of standard devices differ from those of extended voltage devices, they are shown in gray.
Note 1:
This is the limit to which V
DD
can be lowered without losing RAM data.
2:
The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin
loading and switching rate, oscillator type, internal code execution pattern and temperature also have an impact
on the current consumption. The test conditions for all I
DD
measurements in active operation mode are:
OSC1 = external square wave, from rail to rail; all I/O pins tri-stated, pulled to V
DD
,
MCLR = V
DD
; WDT enabled/disabled as specified.
3:
The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is mea-
sured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to V
DD
and V
SS
.
4:
For RC osc mode, current through R
EXT
is not included. The current through the resistor can be estimated by
the formula Ir = V
DD
/2R
EXT
(mA) with R
EXT
in kOhm.
5:
Timer1 oscillator (when enabled) adds approximately 20
μ
A to the specification. This value is from character-
ization and is for design guidance only. This is not tested.
6:
The
current is the additional current consumed when this peripheral is enabled. This current should be
added to the base I
DD
or I
PD
measurement.
7:
When BOR is enabled, the device will operate correctly until the V
BOR
voltage trip point is reached.
8:
In RC oscillator mode, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the
PICmicro device be driven with external clock in RC mode.
9:
The leakage current on the MCLR/V
PP
pin is strongly dependent on the applied voltage level. The specified lev-
els represent normal operating conditions. Higher leakage current may be measured at different input voltages.
10:
Negative current is defined as current sourced by the pin.
3.65
–
4.35
V
BODEN bit set