參數(shù)資料
型號： PIC16F1823-I/ST
廠商： Microchip Technology
文件頁數(shù)： 108/109頁
文件大?。?/td> 0K
描述： IC MCU 8BIT FLASH 14TSSOP
產(chǎn)品培訓(xùn)模塊： 8-bit PIC® Microcontroller Portfolio
特色產(chǎn)品： Extreme Low Power (XLP) Microcontrollers
標(biāo)準(zhǔn)包裝： 96
系列： PIC® XLP™ 16F
核心處理器： PIC
芯體尺寸： 8-位
速度： 32MHz
連通性： I²C，LIN，SPI，UART/USART
外圍設(shè)備： 欠壓檢測/復(fù)位，POR，PWM，WDT
輸入/輸出數(shù)： 12
程序存儲器容量： 3.5KB（2K x 14）
程序存儲器類型： 閃存
EEPROM 大?。?/td> 256 x 8
RAM 容量： 128 x 8
電壓 - 電源 (Vcc/Vdd)： 1.8 V ~ 5.5 V
數(shù)據(jù)轉(zhuǎn)換器： A/D 8x10b
振蕩器型： 內(nèi)部
工作溫度： -40°C ~ 85°C
封裝/外殼： 14-TSSOP（0.173"，4.40mm 寬）
包裝： 管件
PIC12(L)F1822/PIC16(L)F1823
DS41413C-page 8
2010-2012 Microchip Technology Inc.
Table of Contents
1.0
Device Overview ........................................................................................................................................................................ 11
2.0
Enhanced Mid-Range CPU ........................................................................................................................................................ 19
3.0
Memory Organization ................................................................................................................................................................. 21
4.0
Device Configuration .................................................................................................................................................................. 49
5.0
Oscillator Module (With Fail-Safe Clock Monitor)....................................................................................................................... 55
6.0
Reference Clock Module ............................................................................................................................................................ 73
7.0
Resets ........................................................................................................................................................................................ 77
8.0
Interrupts .................................................................................................................................................................................... 87
9.0
Power-Down Mode (Sleep) ........................................................................................................................................................ 99
10.0 Watchdog Timer (WDT) ........................................................................................................................................................... 103
11.0 Data EEPROM and Flash Program Memory Control ............................................................................................................... 107
12.0 I/O Ports ................................................................................................................................................................................... 121
13.0 Interrupt-on-Change ................................................................................................................................................................. 133
14.0 Fixed Voltage Reference (FVR) ............................................................................................................................................... 137
15.0 Temperature Indicator Module ................................................................................................................................................. 139
16.0 Analog-to-Digital Converter (ADC) Module .............................................................................................................................. 141
17.0 Digital-to-Analog Converter (DAC) Module .............................................................................................................................. 155
18.0 SR Latch................................................................................................................................................................................... 159
19.0 Comparator Module.................................................................................................................................................................. 165
20.0 Timer0 Module ......................................................................................................................................................................... 175
21.0 Timer1 Module ......................................................................................................................................................................... 179
22.0 Timer2 Modules........................................................................................................................................................................ 191
23.0 Data Signal Modulator (DSM) .................................................................................................................................................. 195
24.0 Capture/Compare/PWM Module .............................................................................................................................................. 205
25.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 233
26.0 Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) ............................................................... 285
27.0 Capacitive Sensing (CPS) module ........................................................................................................................................... 313
28.0 In-Circuit Serial Programming (ICSP) ................................................................................................................................ 323
29.0 Instruction Set Summary .......................................................................................................................................................... 327
30.0 Electrical Specifications............................................................................................................................................................ 341
31.0 DC and AC Characteristics Graphs and Tables....................................................................................................................... 373
32.0 Development Support............................................................................................................................................................... 401
33.0 Packaging Information.............................................................................................................................................................. 405
Appendix A: Revision History............................................................................................................................................................. 425
Appendix B: Device Differences......................................................................................................................................................... 425
Index .................................................................................................................................................................................................. 425
The Microchip Web Site ..................................................................................................................................................................... 433
Customer Change Notification Service .............................................................................................................................................. 433
Customer Support .............................................................................................................................................................................. 433
Reader Response .............................................................................................................................................................................. 434
Product Identification System............................................................................................................................................................. 435
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
PIC16F1823T-I/ML 功能描述:8位微控制器 -MCU 3.5KB 128B RAM 32MHz Int. Osc 12 I/0 RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時鐘頻率:50 MHz 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT
PIC16F1823T-I/SL 功能描述:8位微控制器 -MCU 3.5KB 128B RAM 32MHz Int. Osc 12 I/0 RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時鐘頻率:50 MHz 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT
PIC16F1823T-I/ST 功能描述:8位微控制器 -MCU 3.5KB 128B RAM 32MHz Int. Osc 12 I/0 RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時鐘頻率:50 MHz 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT
PIC16F1824-E/ML 功能描述:8位微控制器 -MCU 7KB Flash 256b RAM 32 MHz Int. Osc RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時鐘頻率:50 MHz 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT
PIC16F1824-E/P 功能描述:8位微控制器 -MCU 7KB Flash 256b RAM 32 MHz Int. Osc RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時鐘頻率:50 MHz 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT
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