參數(shù)資料
型號(hào)： PIC16F84A-20E/SS
廠商： Microchip Technology
文件頁(yè)數(shù)： 28/81頁(yè)
文件大?。?/td> 0K
描述： IC MCU CMOS 20MHZ 1K FLSH 20SSOP
標(biāo)準(zhǔn)包裝： 67
系列： PIC® 16F
核心處理器： PIC
芯體尺寸： 8-位
速度： 20MHz
外圍設(shè)備： POR，WDT
輸入/輸出數(shù)： 13
程序存儲(chǔ)器容量： 1.75KB（1K x 14）
程序存儲(chǔ)器類型： 閃存
EEPROM 大?。?/td> 64 x 8
RAM 容量： 68 x 8
電壓 - 電源 (Vcc/Vdd)： 4 V ~ 5.5 V
振蕩器型： 外部
工作溫度： -40°C ~ 125°C
封裝/外殼： 20-SSOP（0.209"，5.30mm 寬）
包裝： 管件
配用： XLT20SS1-1-ND - SOCKET TRANSITION 20DIP 20SSOP
PIC16F84A
DS35007B-page 32
2001 Microchip Technology Inc.
6.11
Power-down Mode (SLEEP)
A device may be powered down (SLEEP) and later
powered up (wake-up from SLEEP).
6.11.1
SLEEP
The Power-down mode is entered by executing the
SLEEP
instruction.
If enabled, the Watchdog Timer is cleared (but keeps
running), the PD bit (STATUS<3>) is cleared, the TO bit
(STATUS<4>) is set, and the oscillator driver is turned
off. The I/O ports maintain the status they had before
the SLEEP instruction was executed (driving high, low,
or hi-impedance).
For the lowest current consumption in SLEEP mode,
place all I/O pins at either VDD or VSS, with no external
circuitry drawing current from the I/O pins, and disable
external clocks. I/O pins that are hi-impedance inputs
should be pulled high or low externally to avoid switch-
ing currents caused by floating inputs. The T0CKI input
should also be at VDD or VSS. The contribution from
on-chip pull-ups on PORTB should be considered.
The MCLR pin must be at a logic high level (VIHMC).
It should be noted that a RESET generated by a WDT
time-out does not drive the MCLR pin low.
6.11.2
WAKE-UP FROM SLEEP
The device can wake-up from SLEEP through one of
the following events:
1.
External RESET input on MCLR pin.
2.
WDT wake-up (if WDT was enabled).
3.
Interrupt from RB0/INT pin, RB port change, or
data EEPROM write complete.
Peripherals cannot generate interrupts during SLEEP,
since no on-chip Q clocks are present.
The first event (MCLR Reset) will cause a device
RESET. The two latter events are considered a contin-
uation of program execution. The TO and PD bits can
be used to determine the cause of a device RESET.
The PD bit, which is set on power-up, is cleared when
SLEEP is invoked. The TO bit is cleared if a WDT
time-out occurred (and caused wake-up).
While the SLEEP instruction is being executed, the next
instruction (PC + 1) is pre-fetched. For the device to
wake-up through an interrupt event, the corresponding
interrupt enable bit must be set (enabled). Wake-up
occurs regardless of the state of the GIE bit. If the GIE
bit is clear (disabled), the device continues execution at
the instruction after the SLEEP instruction. If the GIE bit
is set (enabled), the device executes the instruction
after the SLEEP instruction and then branches to the
interrupt address (0004h). In cases
where the
execution of the instruction following SLEEP
is not
desirable, the user should have a NOP after the
SLEEP
instruction.
FIGURE 6-12:
WAKE-UP FROM SLEEP THROUGH INTERRUPT
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
OSC1
CLKOUT(4)
INT pin
INTF Flag
(INTCON<1>)
GIE bit
(INTCON<7>)
INSTRUCTION FLOW
PC
Instruction
Fetched
Instruction
Executed
PC
PC+1
PC+2
Inst(PC) = SLEEP
Inst(PC - 1)
Inst(PC + 1)
SLEEP
Processor in
SLEEP
Interrupt Latency
(Note 2)
Inst(PC + 2)
Inst(PC + 1)
Inst(0004h)
Inst(0005h)
Inst(0004h)
Dummy cycle
PC + 2
0004h
0005h
Dummy cycle
TOST(2)
PC+2
Note
1:
XT, HS, or LP oscillator mode assumed.
2:
TOST = 1024TOSC (drawing not to scale). This delay will not be there for RC osc mode.
3:
GIE = ’1’ assumed. In this case after wake-up, the processor jumps to the interrupt routine. If GIE = ’0’, execution will continue in-line.
4:
CLKOUT is not available in these osc modes, but shown here for timing reference.
相關(guān)PDF資料
PDF描述
22-15-3113 CONN FFC/FPC 11POS .100 RT ANG
22-02-3113 CONN FFC/FPC VERTICAL 11POS .100
PIC16F84A-20E/SO IC MCU CMOS 20MHZ 1K FLSH 18SOIC
PIC16F84A-04E/SS IC MCU CMOS 4MHZ 1K FLASH 20SSOP
PIC16F84A-04E/SO IC MCU CMOS 4MHZ 1K FLASH 18SOIC
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
PIC16F84A-20I/P 功能描述:8位微控制器 -MCU 1.75KB 68 RAM 13 I/O 20MHz IndTemp PDIP18 RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT
PIC16F84A-20I/P 制造商:Microchip Technology Inc 功能描述:IC 8BIT FLASH MCU 16F84 DIP18
PIC16F84A-20I/SO 功能描述:8位微控制器 -MCU 1.75KB 68 RAM 13 I/O 20MHz IndTemp SOIC18 RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT
PIC16F84A-20I/SO 制造商:Microchip Technology Inc 功能描述:8BIT FLASH MCU SMD 16F84 SOIC18
PIC16F84A-20I/SS 功能描述:8位微控制器 -MCU 1.75KB 68 RAM 13 I/O 20MHz IndTemp SSOP20 RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT
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