參數(shù)資料
型號(hào)： PIC16LF1824-E/P
廠商： Microchip Technology
文件頁(yè)數(shù)： 3/101頁(yè)
文件大小： 0K
描述： IC MCU 8BIT 7KB FLASH 14PDIP
標(biāo)準(zhǔn)包裝： 30
系列： PIC® XLP™ mTouch™ 16F
核心處理器： PIC
芯體尺寸： 8-位
速度： 32MHz
連通性： I²C，SPI，UART/USART
外圍設(shè)備： 欠壓檢測(cè)/復(fù)位，POR，PWM，WDT
輸入/輸出數(shù)： 11
程序存儲(chǔ)器容量： 7KB（4K x 14）
程序存儲(chǔ)器類型： 閃存
EEPROM 大小： 256 x 8
RAM 容量： 256 x 8
電壓 - 電源 (Vcc/Vdd)： 1.8 V ~ 3.6 V
數(shù)據(jù)轉(zhuǎn)換器： A/D 8x10b
振蕩器型： 內(nèi)部
工作溫度： -40°C ~ 125°C
封裝/外殼： 14-DIP（0.300"，7.62mm）
包裝： 管件
2010-2011 Microchip Technology Inc.
Preliminary
DS41419C-page 11
PIC16(L)F1824/1828
Table of Contents
1.0
Device Overview ........................................................................................................................................................................ 13
2.0
Enhanced Mid-Range CPU ........................................................................................................................................................ 21
3.0
Memory Organization ................................................................................................................................................................. 23
4.0
Device Configuration .................................................................................................................................................................. 51
5.0
Oscillator Module (With Fail-Safe Clock Monitor)....................................................................................................................... 57
6.0
Reference Clock Module ............................................................................................................................................................ 75
7.0
Resets ........................................................................................................................................................................................ 79
8.0
Interrupts .................................................................................................................................................................................... 87
9.0
Power-Down Mode (Sleep) ...................................................................................................................................................... 101
10.0 Watchdog Timer (WDT) ........................................................................................................................................................... 103
11.0 Data EEPROM and Flash Program Memory Control ............................................................................................................... 107
12.0 I/O Ports ................................................................................................................................................................................... 121
13.0 Interrupt-on-Change ................................................................................................................................................................. 141
14.0 Fixed Voltage Reference (FVR) ............................................................................................................................................... 145
15.0 Temperature Indicator Module ................................................................................................................................................. 147
16.0 Analog-to-Digital Converter (ADC) Module .............................................................................................................................. 149
17.0 Digital-to-Analog Converter (DAC) Module .............................................................................................................................. 163
18.0 SR Latch................................................................................................................................................................................... 169
19.0 Comparator Module.................................................................................................................................................................. 175
20.0 Timer0 Module ......................................................................................................................................................................... 185
21.0 Timer1 Module ......................................................................................................................................................................... 189
22.0 Timer2/4/6 Modules.................................................................................................................................................................. 201
23.0 Data Signal Modulator (DSM) .................................................................................................................................................. 205
24.0 Capture/Compare/PWM Module .............................................................................................................................................. 215
25.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 243
26.0 Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) ............................................................... 297
27.0 Capacitive Sensing Module...................................................................................................................................................... 325
28.0 In-Circuit Serial Programming (ICSP) ................................................................................................................................ 333
29.0 Instruction Set Summary .......................................................................................................................................................... 337
30.0 Electrical Specifications............................................................................................................................................................ 351
31.0 DC and AC Characteristics Graphs and Tables....................................................................................................................... 383
32.0 Development Support............................................................................................................................................................... 385
33.0 Packaging Information.............................................................................................................................................................. 389
Appendix A: Revision History............................................................................................................................................................. 409
Appendix B: Device Differences ........................................................................................................................................................ 409
Index .................................................................................................................................................................................................. 411
The Microchip Web Site..................................................................................................................................................................... 419
Customer Change Notification Service .............................................................................................................................................. 419
Customer Support.............................................................................................................................................................................. 419
Reader Response .............................................................................................................................................................................. 420
Product Identification System ............................................................................................................................................................ 421
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參數(shù)描述
PIC16LF1824-I/ML 功能描述:8位微控制器 -MCU 7KB Flash 256B RAM 32 MHz Int Osc Core RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT
PIC16LF1824-I/P 功能描述:8位微控制器 -MCU 7KB Flash 256B RAM 32 MHz Int Osc Core RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT
PIC16LF1824-I/SL 功能描述:8位微控制器 -MCU 7KB Flash 256B RAM 32 MHz Int Osc Core RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT
PIC16LF1824-I/ST 功能描述:8位微控制器 -MCU 7KB Flash 256B RAM 32 MHz Int Osc Core RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT
PIC16LF1824T39A-I/ST 制造商:Microchip Technology 功能描述:MCU 8-bit PIC16 PIC RISC 7KB Flash 2.5V/3.3V 20-Pin TSSOP 制造商:Microchip Technology Inc 功能描述:PIC16LF1824 MICROCONTROLLER WITH 300-900 MHZ TRANSMITTER - Rail/Tube 制造商:Microchip Technology Inc 功能描述:IC MCU 8BIT FLASH 20TSSOP 制造商:Microchip Technology Inc 功能描述:PIC16LF1824 Microcontroller
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