參數(shù)資料
型號(hào)： PIC16LF1933-E/SS
廠商： Microchip Technology
文件頁(yè)數(shù)： 12/40頁(yè)
文件大小： 0K
描述： MCU PIC 8BIT 4K FLASH 28SSOP
標(biāo)準(zhǔn)包裝： 47
系列： PIC® XLP™ 16F
核心處理器： PIC
芯體尺寸： 8-位
速度： 32MHz
連通性： I²C，LIN，SPI，UART/USART
外圍設(shè)備： 欠壓檢測(cè)/復(fù)位，LCD，POR，PWM，WDT
輸入/輸出數(shù)： 25
程序存儲(chǔ)器容量： 7KB（4K x 14）
程序存儲(chǔ)器類型： 閃存
EEPROM 大?。?/td> 256 x 8
RAM 容量： 256 x 8
電壓 - 電源 (Vcc/Vdd)： 1.8 V ~ 3.6 V
數(shù)據(jù)轉(zhuǎn)換器： A/D 11x10b
振蕩器型： 內(nèi)部
工作溫度： -40°C ~ 125°C
封裝/外殼： 28-SSOP（0.209"，5.30mm 寬）
包裝： 管件
PIC16F193X/LF193X
DS41360A-page 2
Advance Information
2008 Microchip Technology Inc.
Table of Contents
1.0
Overview ..................................................................................................................................................................................... 1
1.1
Hardware Requirements ......................................................................................................................................................... 1
1.1.1
High-Voltage ICSP Programming ................................................................................................................................ 1
1.1.2
Low-Voltage ICSP Programming ................................................................................................................................. 1
1.2
Pin Utilization .......................................................................................................................................................................... 1
2.0
Device Pinouts ............................................................................................................................................................................ 3
3.0
Memory Map ............................................................................................................................................................................... 8
3.1
User ID Location ..................................................................................................................................................................... 9
3.2
Device ID ................................................................................................................................................................................ 9
3.3
Configuration Words ............................................................................................................................................................. 10
3.4
Calibration Words ................................................................................................................................................................. 10
4.0
Program/Verify Mode ................................................................................................................................................................ 13
4.1
High Voltage Program/Verify Mode Entry and Exit ............................................................................................................... 13
4.1.1
VPP – First Entry Mode ............................................................................................................................................... 13
4.1.2
VDD – First Entry Mode .............................................................................................................................................. 13
4.1.3
Program/Verify Mode Exit .......................................................................................................................................... 13
4.2
Low-Voltage Programming (LVP) Mode ............................................................................................................................... 13
4.3
Program/Verify Commands ................................................................................................................................................... 14
4.3.1
Load Configuration ..................................................................................................................................................... 15
4.3.2
Load Data For Program Memory ............................................................................................................................... 15
4.3.3
Load Data For Data Memory ...................................................................................................................................... 16
4.3.4
Read Data From Program Memory ............................................................................................................................ 16
4.3.5
Read Data From Data Memory .................................................................................................................................. 17
4.3.6
Increment Address ..................................................................................................................................................... 17
4.3.7
Reset Address ............................................................................................................................................................ 18
4.3.8
Begin Internally Timed Programming ......................................................................................................................... 18
4.3.9
Begin Externally Timed Programming ........................................................................................................................ 19
4.3.10 End Externally Timed Programming .......................................................................................................................... 19
4.3.11 Bulk Erase Program Memory ..................................................................................................................................... 20
4.3.12 Bulk Erase Data Memory ........................................................................................................................................... 20
4.3.13 Row Erase Program Memory ..................................................................................................................................... 21
5.0
Programming Algorithms ........................................................................................................................................................... 22
6.0
Code Protection ......................................................................................................................................................................... 30
6.1
Program Memory .................................................................................................................................................................. 30
6.2
Data Memory ........................................................................................................................................................................ 30
7.0
Hex File Usage .......................................................................................................................................................................... 30
7.1
Configuration Word ............................................................................................................................................................... 30
7.2
Device ID and Revision ......................................................................................................................................................... 30
7.3
Data EEPROM ...................................................................................................................................................................... 30
7.4
Checksum Computation ........................................................................................................................................................ 31
7.4.1
Code Protection Disabled .......................................................................................................................................... 31
7.4.2
Code Protection Enabled ........................................................................................................................................... 32
8.0
Electrical Specifications............................................................................................................................................................. 33
8.1
AC Timing Diagrams ............................................................................................................................................................. 34
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
PIC16LF1933-I/ML 功能描述:8位微控制器 -MCU 7KB Flash 1.8-5.5V 256B RAM 256B EEPROM RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT
PIC16LF1933-I/MV 功能描述:8位微控制器 -MCU 7KB FL 256BRAM 256B EE LCD nanoWatt XLP RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT
PIC16LF1933-I/MV 制造商:Microchip Technology Inc 功能描述:; Controller Family/Series:PIC16LF; Core
PIC16LF1933-I/SO 功能描述:8位微控制器 -MCU 7KB Flash 1.8-5.5V 256B RAM 256B EEPROM RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT
PIC16LF1933-I/SP 功能描述:8位微控制器 -MCU 7KB Flash 1.8-5.5V 256B RAM 256B EEPROM RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT
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