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| 型號(hào)： | PIC16LF876-04ISO |
| 英文描述： | Microcontroller |
| 中文描述： | 微控制器 |
| 文件頁(yè)數(shù)： | 10/67頁(yè) |
| 文件大?。?/td> | 2723K |
| 代理商： | PIC16LF876-04ISO |
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Rev. 2.0, 03/06/02, 9
2.
Build Basics
This chapter explains the general functions of the HEW whilst the more advanced features can be found in
chapter 3, “Advanced Build Features”.
2.1
The Build Process
The typical build process is outlined in figure 2.1. This may not be the exact build process, which your
installation of HEW will use as it depends upon the tools that were provided with your installation of HEW (e.g.
you may not have a compiler for instance). In any case, the principles are the same - each step or phase of the
build takes a set of project files and then builds them, if all succeeds then the next step or phase is executed.
Project
Object
Files
C
Source Files
Assembler
Source Files
Library
Files
Load
Module
BUILD
COMPILER
ASSEMBLER
LINKER
Figure 2.1: Typical Build Process
In the example shown in figure 2.1 the compiler is the first phase, the assembler is the second phase and the
linker is the third and final phase. During the compiler phase, the C source files from the project are compiled in
turn, during the assembler phase, the assembler source files are assembled in turn. During the linker phase all
library files and output files from the compiler and assembler phases are linked together to produce the load
module. This module can then be downloaded and used by the debugger functionality in HEW.
The build process can be customized in several ways. For instance, you can add your own phase, disable a phase,
delete phases and so forth. These advanced build issues are left to chapter 3, “Advanced Build Features”. In this
chapter, only the general principles and basic features will be detailed.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| PIC16F88 | PIC16F87/88 FLASH Memory Programming Specification |
| PIC16F877T-20PT301 | Microcontroller |
| PIC16F877T-20PT | 8-BIT MICROCONTROLLER |
| PIC16F877T-20PQ301 | Microcontroller |
| PIC16F877T-20PQ | 8-BIT MICROCONTROLLER |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PIC16LF876A-I/M | 制造商:Microchip Technology Inc 功能描述:PIC16 Series 10 MHz 14 KB Flash 368 Byte SRAM 8-Bit Microcontroller - QFN-28 制造商:Microchip Technology Inc 功能描述:PIC16 Series 14 KB RAM 8 K x 14 Bit CMOS 8-Bit Microcontroller - QFN-28 |
| PIC16LF876AI/ML | 制造商:Microchip Technology Inc 功能描述:MicroController, 8-Bit, 28 Pin, Plastic, LCC |
| PIC16LF876A-I/ML | 功能描述:8位微控制器 -MCU 14KB 368 RAM 22 I/O RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT |
| PIC16LF876A-I/SO | 功能描述:8位微控制器 -MCU 14KB 368 RAM 22 I/O RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT |
| PIC16LF876A-I/SO | 制造商:Microchip Technology Inc 功能描述:IC 8BIT FLASH MCU 16LF876 SOIC28 |
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