參數(shù)資料
型號(hào): PIC24HJ64GP504-E/PT
廠商: Microchip Technology
文件頁數(shù): 81/84頁
文件大?。?/td> 0K
描述: IC PIC MCU FLASH 64K 44-TQFP
標(biāo)準(zhǔn)包裝: 160
系列: PIC® 24H
核心處理器: PIC
芯體尺寸: 16-位
速度: 40 MIP
連通性: CAN,I²C,IrDA,LIN,PMP,SPI,UART/USART
外圍設(shè)備: 欠壓檢測(cè)/復(fù)位,DMA,POR,PWM,WDT
輸入/輸出數(shù): 35
程序存儲(chǔ)器容量: 64KB(22K x 24)
程序存儲(chǔ)器類型: 閃存
RAM 容量: 8K x 8
電壓 - 電源 (Vcc/Vdd): 3 V ~ 3.6 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 13x10b/12b
振蕩器型: 內(nèi)部
工作溫度: -40°C ~ 125°C
封裝/外殼: 44-TQFP
包裝: 托盤
產(chǎn)品目錄頁面: 648 (CN2011-ZH PDF)
配用: 876-1004-ND - PIC24 BREAKOUT BOARD
DM240001-ND - BOARD DEMO PIC24/DSPIC33/PIC32
dsPIC33F/PIC24H PROGRAMMING SPECIFICATION
DS70152H-page 82
2010 Microchip Technology Inc.
Revision H (October 2010)
This revision includes the following updates:
Text and formatting updates have been
incorporated throughout the document
All references to VCAP/VDDCORE have been
changed to: VCAP
All occurrences of PGC and PGD have been
changed to PGCx and PGDx, respectively
Added topics covered in Section 1.0 “Device
Moved the Checksum Computation table to the
appendix (see Table D-1)
Updated all occurrences of TBLPG to TBLPAG
throughout the document
Removed the ERASEB command from the
Command Set Summary (see Table 3-1)
Updated the High-Level Enhanced ICSP
Programming Flow (see Figure 3-1)
Replaced the Device Configuration Register Map
(previously Table 4-3) with individual tables for
each dsPIC33F/PIC24H device family (see
Updated the Note in Section 3.6.2
Changed Opcode 0x7 to Reserved in the
Programming Executive Command Set (see
Removed 4.2.10 “ERASEB Command”
Updated the table cross-references in
Combined all Default Configuration Register
Values tables into one table (see Table 5-6)
Relocated the paragraph on ICSP programming
details, which now appears just before Table 5-7
Updated Step 4 in Programming the Programming
Executive (see Table 6-1)
Updated Device IDs and Revision IDs (see
Updated parameters D111, P1, P1A and P1B in
the AC/DC Characteristics and Timing
Requirements (see Table 8-1)
Added Checksum Computation Example When
Using CodeGuard Security (see Table D-2).
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PIC24HJ64GP504-H/ML 功能描述:16位微控制器 - MCU 16Bit 32KB Flash RAM 2048b nanoWatt RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數(shù)據(jù)總線寬度:16 bit 最大時(shí)鐘頻率:24 MHz 程序存儲(chǔ)器大小:8 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風(fēng)格:SMD/SMT
PIC24HJ64GP504-H/PT 功能描述:16位微控制器 - MCU 16Bit 32KB Flash RAM 2048b nanoWatt RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數(shù)據(jù)總線寬度:16 bit 最大時(shí)鐘頻率:24 MHz 程序存儲(chǔ)器大小:8 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風(fēng)格:SMD/SMT
PIC24HJ64GP504-I/ML 功能描述:16位微控制器 - MCU 16B MCU 44LD64KB DMA 40MIPS RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數(shù)據(jù)總線寬度:16 bit 最大時(shí)鐘頻率:24 MHz 程序存儲(chǔ)器大小:8 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風(fēng)格:SMD/SMT
PIC24HJ64GP504-I/PT 功能描述:16位微控制器 - MCU 16B MCU 64KB DMA 40MIPS RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數(shù)據(jù)總線寬度:16 bit 最大時(shí)鐘頻率:24 MHz 程序存儲(chǔ)器大小:8 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風(fēng)格:SMD/SMT
PIC24HJ64GP504T-I/ML 功能描述:16位微控制器 - MCU 16B MCU 44LD64KB DMA 40MIPS RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數(shù)據(jù)總線寬度:16 bit 最大時(shí)鐘頻率:24 MHz 程序存儲(chǔ)器大小:8 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風(fēng)格:SMD/SMT