參數(shù)資料
型號(hào): PIP201-12M
英文描述: Analog IC
中文描述: 模擬IC
文件頁數(shù): 9/20頁
文件大?。?/td> 319K
代理商: PIP201-12M
Philips Semiconductors
PIP201-12M
DC to DC converter powertrain
Preliminary data
Rev. 01 — 24 January 2002
17 of 20
9397 750 09032
Koninklijke Philips Electronics N.V. 2002. All rights reserved.
16. Mounting
As shown in Figure 16, the terminals on the underside of the package are rectangular
in shape with a rounded edge on the inside. Electrical connection between the
package and the printed-circuit board is made by printing solder paste onto the PCB
footprint followed by component placement and reow soldering. The PCB footprint
shown in Figure 17 is designed to form reliable solder joints.
In addition to the dimensions shown, a gap of at least 0.1 mm is recommended
between each of the metal pads on the underside of the package, and also between
the metal pads and the edge terminations. These clearances may need to be
increased to prevent solder bridging. The use of solder resist between each pad is
recommended.
Good surface atness of the PCB footprint is desirable to ensure accuracy of
placement after soldering. Printed-circuit boards that are nished with a roller tin
process tend to leave small lumps of tin in the corners of each land. Levelling with a
hot air knife improves atness. Alternatively, an electro-less silver or silver immersion
process produces completely at PCB pads.
All dimensions in mm.
Fig 17. PCB footprint for SOT687 package (reow soldering).
03ag37
10.36
max
8.48
max
8.28
max
8.18
0.1 min
0.15 min
0.28 max
0.94
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