- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄370003 > PIP250M Integrated buck converter PDF資料下載
參數(shù)資料
| 型號： | PIP250M |
| 英文描述： | Integrated buck converter |
| 中文描述： | 集成的降壓轉(zhuǎn)換器 |
| 文件頁數(shù)： | 15/19頁 |
| 文件大小： | 334K |
| 代理商： | PIP250M |
Philips Semiconductors
PIP250M
Integrated buck converter
Product data
Rev. 02 — 21 February 2003
15 of 19
9397 750 10904
Koninklijke Philips Electronics N.V. 2003. All rights reserved.
14.2 Rework guidelines
Since the solder joints are largely inaccessible, only the side fillets can be touched
up. If there are defects underneath the package, then the whole package has to be
removed.
The first step in component removal is to reflow the solder joints. It is recommended
that the board is heated from the underside using a convective heater whilst hot air or
gas is directed at the upper surface of the component. Nozzles should be used to
direct the hot air or gas to minimize heating of adjacent components. Excessive
airflow should be avoided since this may cause the package to skew. An airflow of 15
to 20 liters per minute is usually adequate.
Once the solder joints have reflowed, the component should be lifted off the board
using a vacuum pen.
The next step is to clean the solder pads using solder braid and a blade shaped
soldering tool. Finally, the pads should be cleaned with a solvent. The solvent is
usually specific to the type of solder paste used in the original assembly and the
paste manufacturers recommendations should be followed.
15. Mounting
15.1 PCB design guidelines
The terminals on the underside of the package are rectangular in shape with a
rounded edge on the inside. Electrical connection between the package and the
printed-circuit board is made by printing solder paste onto the PCB footprint followed
by component placement and reflow soldering. The PCB footprint shown in
Figure 15
is designed to form reliable solder joints.
The use of solder resist between each solder land is recommended. PCB tracks
should not be routed through the corner areas shown in
Figure 15
. This is because
there is a small, exposed remnant of the lead frame in each corner of the package,
left over from the cropping process.
Good surface flatness of the PCB lands is desirable to ensure accuracy of placement
after soldering. Printed-circuit boards that are finished with a roller tin process tend to
leave small lumps of tin in the corners of each land. Levelling with a hot air knife
improves flatness. Alternatively, an electro-less silver or silver immersion process
produces completely flat PCB lands.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| PIP3103-T | TRANSISTOR | MOSFET | N-CHANNEL | SOT-223 |
| PIP3106-D | TRANSISTOR | MOSFET | N-CHANNEL | 50V V(BR)DSS | TO-252AA |
| PIP3107-D | TRANSISTOR | MOSFET | N-CHANNEL | 50V V(BR)DSS | TO-252AA |
| PIP3104 | PowerMOS transistor Logic level TOPFET |
| PIP3104-P | PowerMOS transistor Logic level TOPFET |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PIP250M,518 | 功能描述:IC REG BUCK SYNC ADJ 15A 68HVQFN RoHS:否 類別:集成電路 (IC) >> PMIC - 穩(wěn)壓器 - DC DC 開關(guān)穩(wěn)壓器 系列:- 標(biāo)準(zhǔn)包裝:20 系列:SIMPLE SWITCHER® 類型:降壓（降壓） 輸出類型:固定 輸出數(shù):1 輸出電壓:12V 輸入電壓:4 V ~ 60 V PWM 型:電壓模式 頻率 - 開關(guān):52kHz 電流 - 輸出:1A 同步整流器:無 工作溫度:-40°C ~ 125°C 安裝類型:通孔 封裝/外殼:16-DIP（0.300"，7.62mm） 包裝:管件 供應(yīng)商設(shè)備封裝:16-DIP 其它名稱:*LM2575HVN-12LM2575HVN-12 |
| PIP26U | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Fibers can be free cut using fiber cutter |
| PIP30 | 制造商:Microsemi Corporation 功能描述:TVS SGL BI-DIR 42.5V 7.5KW 2PIN CASE 11 - Bulk 制造商:ProTek Devices 功能描述:Suppressor Assembly 30V 7.5KW |
| PIP3101-A,127 | 功能描述:MOSFET RAIL TOPFET2 RoHS:否 制造商:STMicroelectronics 晶體管極性:N-Channel 汲極/源極擊穿電壓:650 V 閘/源擊穿電壓:25 V 漏極連續(xù)電流:130 A 電阻汲極/源極 RDS（導(dǎo)通）:0.014 Ohms 配置:Single 最大工作溫度: 安裝風(fēng)格:Through Hole 封裝 / 箱體:Max247 封裝:Tube |
| PIP3102-R | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:LOGIC LEVEL TOPFET |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。