2. VDD = 3.3 V, TA = 25 °C, f
參數(shù)資料
型號(hào): PK30X256VMD100
廠商: Freescale Semiconductor
文件頁數(shù): 13/74頁
文件大?。?/td> 0K
描述: IC ARM CORTEX MCU 256K 144-MAP
產(chǎn)品培訓(xùn)模塊: Kinetis® Cortex-M4 Microcontroller Family
標(biāo)準(zhǔn)包裝: 1
系列: Kinetis
核心處理器: ARM? Cortex?-M4
芯體尺寸: 32-位
速度: 100MHz
連通性: CAN,EBI/EMI,I²C,IrDA,SDHC,SPI,UART/USART
外圍設(shè)備: DMA,I²S,LCD,LVD,POR,PWM,WDT
輸入/輸出數(shù): 102
程序存儲(chǔ)器容量: 256KB(256K x 8)
程序存儲(chǔ)器類型: 閃存
EEPROM 大小: 4K x 8
RAM 容量: 64K x 8
電壓 - 電源 (Vcc/Vdd): 1.71 V ~ 3.6 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 37x16b,D/A 2x12b
振蕩器型: 內(nèi)部
工作溫度: -40°C ~ 105°C
封裝/外殼: 144-LBGA
包裝: 托盤
2. VDD = 3.3 V, TA = 25 °C, fOSC = 12 MHz (crystal), fSYS = 96 MHz, fBUS = 48MHz
3. Specified according to Annex D of IEC Standard 61967-2, Measurement of Radiated Emissions—TEM Cell and Wideband
TEM Cell Method
5.2.7 Designing with radiated emissions in mind
To find application notes that provide guidance on designing your system to minimize
interference from radiated emissions:
2. Perform a keyword search for “EMC design.”
5.2.8 Capacitance attributes
Table 8. Capacitance attributes
Symbol
Description
Min.
Max.
Unit
CIN_A
Input capacitance: analog pins
7
pF
CIN_D
Input capacitance: digital pins
7
pF
5.3 Switching specifications
5.3.1 Device clock specifications
Table 9. Device clock specifications
Symbol
Description
Min.
Max.
Unit
Notes
Normal run mode
fSYS
System and core clock
100
MHz
fBUS
Bus clock
50
MHz
FB_CLK
FlexBus clock
50
MHz
fFLASH
Flash clock
25
MHz
fLPTMR
LPTMR clock
25
MHz
5.3.2 General switching specifications
These general purpose specifications apply to all signals configured for GPIO, UART,
CAN, CMT, and I2C signals.
General
K30 Sub-Family Data Sheet Data Sheet, Rev. 7, 02/2013.
20
Freescale Semiconductor, Inc.
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