2. VDD = 3.3 V, TA = 25 °C, f
參數(shù)資料
型號(hào): PK60X256VLQ100
廠商: Freescale Semiconductor
文件頁(yè)數(shù): 14/79頁(yè)
文件大?。?/td> 0K
描述: IC ARM CORTEX MCU 256K 144-LQFP
產(chǎn)品培訓(xùn)模塊: Kinetis® Cortex-M4 Microcontroller Family
標(biāo)準(zhǔn)包裝: 1
系列: Kinetis
核心處理器: ARM? Cortex?-M4
芯體尺寸: 32-位
速度: 100MHz
連通性: CAN,EBI/EMI,以太網(wǎng),I²C,IrDA,SDHC,SPI,UART/USART,USB,USB OTG
外圍設(shè)備: DMA,I²S,LVD,POR,PWM,WDT
輸入/輸出數(shù): 100
程序存儲(chǔ)器容量: 256KB(256K x 8)
程序存儲(chǔ)器類型: 閃存
EEPROM 大?。?/td> 4K x 8
RAM 容量: 64K x 8
電壓 - 電源 (Vcc/Vdd): 1.71 V ~ 3.6 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 33x16b,D/A 2x12b
振蕩器型: 內(nèi)部
工作溫度: -40°C ~ 105°C
封裝/外殼: 144-LQFP
包裝: 托盤
2. VDD = 3.3 V, TA = 25 °C, fOSC = 12 MHz (crystal), fSYS = 96 MHz, fBUS = 48MHz
3. Specified according to Annex D of IEC Standard 61967-2, Measurement of Radiated Emissions—TEM Cell and Wideband
TEM Cell Method
5.2.7 Designing with radiated emissions in mind
To find application notes that provide guidance on designing your system to minimize
interference from radiated emissions:
2. Perform a keyword search for “EMC design.”
5.2.8 Capacitance attributes
Table 8. Capacitance attributes
Symbol
Description
Min.
Max.
Unit
CIN_A
Input capacitance: analog pins
7
pF
CIN_D
Input capacitance: digital pins
7
pF
5.3 Switching specifications
5.3.1 Device clock specifications
Table 9. Device clock specifications
Symbol
Description
Min.
Max.
Unit
Notes
Normal run mode
fSYS
System and core clock
100
MHz
fSYS_USB
System and core clock when Full Speed USB in
operation
20
MHz
fENET
System and core clock when ethernet in operation
10 Mbps
100 Mbps
5
50
MHz
fBUS
Bus clock
50
MHz
FB_CLK
FlexBus clock
50
MHz
fFLASH
Flash clock
25
MHz
fLPTMR
LPTMR clock
25
MHz
General
K60 Sub-Family Data Sheet Data Sheet, Rev. 7, 02/2013.
Freescale Semiconductor, Inc.
21
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