17
EN/LZT 146 120 R2B Ericsson Power Modules AB, March 2003
Case to ambient thermal resistance
Thermal resistance
0
2
4
6
8
10
12
14
0,0
0,5
1,0
1,5
2,0
2,5
3,0
(m/s)
(°C/W)
Tested in windtunnel with a cross section of 305×305mm mounted
on a 2 layer PCB with a size of 230×160mm.
Airspeed measured at module.
Calculation of temperature increase of case
1.
First we need to know the powerloss by using the formula:
((
) - 1) × output power = losses.
η = efficiency of converter. E.g 89% = 0.89
2.
Then we take the powerlosses × thermal resistance at the air
speed in your system. This gives the temperature increase.
3.
Max allowed ambient temperature, is max allowed case
temperature (100°C) – temperature increase.
E.g PKD 4210 at 1m/s:
1
η
Soldering information
The PKD series of DC/DC power modules are manufactured
in surface mount technology. Extra precautions must there-
fore be taken when reow soldering. Neglecting the soldering
information given below may result in permanent damage or
signicant degradation of power module performance.
The PKD series can be reow soldered using Natural Convec-
tion, Forced Convection Technologies. The high thermal mass
of the component and its effect on temperature requires that
particular attention be paid to other temperature sensitive
components.
Please measure temperatures on pin: 22
Ramp and slope: max 4°C per second.
B. 3.275W × 9.0°C/W = 29.5°C
C.100°C - 29.5°C = max ambient temperature is 70.5°C
The real temperature will be dependent on several factors
like PCB size, direction of air ow, air turbulence etc. Please
always verify by testing.
A. ((
) - 1) × 26.5W = 3.275W
1
0.89
Low temperature solder 1)
Peak 210-235°C
Min 10 s over 200°C
30-100 s over 183°C
High temperature solder 2)
Peak 235-260°C
Min 20 s over 230°C
30-100 s over 221°C
Input and output impedance
Both the source impedance of the power feeding and the load
impedance will interact with the impedance of the
DC/DC power module. It is most important to have the ratio
between L and C as low as possible, i.e. a low characteristic
impedance, both at the input and output, as the power mo-
dules have a low energy storage capability. Use an electrolytic
capacitor across the input if the source inductance is larger than
10 H.
The equivalent series resistance of these capacitors
together with the capacitance acts as a lossless damping lter.
Suitable capacitor values are in the range 10 –100 F.
Protection and control function
Remote Control pin (RC)
The PKD power modules are offered with either positive or
negative logic to turn the converter on or off.
The SI version has positive logic and the converter will turn on
if the input voltage is applied with the RC pin open. Turn off is
achieved by connecting the RC pin to the minus input. To en-
sure safe turn off of the SI version the voltage difference between
negative input pin (–In) and the remote control pin (RC) shall
be less than 0.6V. The converter will restart when this connec-
tion is opened.
The SIN version has negative logic and will be off until the
RC pin is connected to the minus input.
To turn on the SIN version the voltage between RC pin and
minus input should be less than 1V.
To turn off the SIN version the RC pin should be left open, or
should be connected to a voltage higher than 4V referenced to
minus input. RC is CMOS open drain compatible. Current is
less than 1mA and voltage less than 15V.
1) Solder with a melting point approximately 180°C.
2) Solder with a melting point approximately 220°C.
1m/s = 200 lfm