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參數(shù)資料
| 型號： | PKU4104BPILB/C |
| 廠商： | ERICSSON POWER MODULES AB |
| 元件分類： | 電源模塊 |
| 英文描述： | 1-OUTPUT 103.75 W DC-DC REG PWR SUPPLY MODULE |
| 封裝： | ROHS COMPLIANT PACKAGE-5 |
| 文件頁數(shù)： | 8/18頁 |
| 文件大?。?/td> | 1120K |
| 代理商： | PKU4104BPILB/C |
Ericsson Internal
PRODUCT SPEC.MECH.
1 (4)
Prepared (also subject responsible if other)
No.
EXXUYNG
5/1301-BMR 654 Uen
Approved
Checked
Date
Rev
Reference
SEC/D [Betty Wu]
See §1
2009-01-13
E
Soldering Information - Surface Mounting
The surface mount product is intended for forced convection or
vapor phase reflow soldering in SnPb or Pb-free processes.
The reflow profile should be optimised to avoid excessive
heating of the product. It is recommended to have a sufficiently
extended preheat time to ensure an even temperature across
the host PCB and it is also recommended to minimize the time
in reflow.
A no-clean flux is recommended to avoid entrapment of
cleaning fluids in cavities inside the product or between the
product and the host board, since cleaning residues may affect
long time reliability and isolation voltage.
Minimum Pin Temperature Recommendations
Pin number 5 is chosen as reference location for the minimum
pin temperature recommendation since this will likely be the
coolest solder joint during the reflow process.
SnPb solder processes
For SnPb solder processes, a pin temperature (TPIN) in excess
of the solder melting temperature, (TL, 183°C for Sn63Pb37) for
more than 30 seconds and a peak temperature of 210°C is
recommended to ensure a reliable solder joint.
Lead-free (Pb-free) solder processes
For Pb-free solder processes, a pin temperature (TPIN) in
excess of the solder melting temperature (TL, 217 to 221°C for
SnAgCu solder alloys) for more than 30 seconds and a peak
temperature of 235°C on all solder joints is recommended to
ensure a reliable solder joint.
General reflow process specifications
SnPb eutectic
Pb-free
Average ramp-up (TPRODUCT)
3°C/s max
Typical solder melting (liquidus)
temperature
TL
183°C
221°C
Minimum reflow time above TL
30 s
Minimum pin temperature
TPIN
210°C
235°C
Peak product temperature
TPRODUCT
225°C
260°C
Average ramp-down (TPRODUCT)
6°C/s max
Maximum time 25°C to peak
6 minutes
8 minutes
T
PRODUCT maximum
T
PIN minimum
Time
Pin
profile
Product
profile
T
L
Time in
reflow
Time in preheat
/ soak zone
Time 25°C to peak
Temperature
Maximum Product Temperature Requirements
Top of the product PCB near pin 2 is chosen as reference
location for the maximum (peak) allowed product temperature
(TPRODUCT) since this will likely be the warmest part of the
product during the reflow process.
SnPb solder processes
For SnPb solder processes, the product is qualified for MSL 1
according to IPC/JEDEC standard J-STD-020C.
During reflow TPRODUCT must not exceed 225 °C at any time.
Pb-free solder processes
For Pb-free solder processes, the product is qualified for MSL 3
according to IPC/JEDEC standard J-STD-020C.
During reflow TPRODUCT must not exceed 260 °C at any time.
Dry Pack Information
Products intended for Pb-free reflow soldering processes are
delivered in standard moisture barrier bags according to
IPC/JEDEC standard J-STD-033 (Handling, packing, shipping
and use of moisture/reflow sensitivity surface mount devices).
Using products in high temperature Pb-free soldering
processes requires dry pack storage and handling. In case the
products have been stored in an uncontrolled environment and
no longer can be considered dry, the modules must be baked
according to J-STD-033.
Thermocoupler Attachment
Pin 5 for measurement of minimum pin
(solder joint) temperature, T
PIN
Pin 2 for measurement of maximum product
temperature, TPRODUCT
E
PKU 4000B PI series
Intermediate Bus Converters
Input 36-75 V, Output up to 20 A / 100 W
EN/LZT 146 376 R3B July 2009
Ericsson AB
Technical Specication
16
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