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參數(shù)資料
| 型號： | PLCCSMT52T1R |
| 廠商： | DELPHI CONNECTION SYSTEMS |
| 元件分類： | 插座 |
| 英文描述： | PLCC52, IC SOCKET |
| 文件頁數(shù)： | 1/2頁 |
| 文件大?。?/td> | 80K |
| 代理商： | PLCCSMT52T1R |
Product Type
Surface mount PLCC sockets
Total No. of Positions
20, 28, 32, 44, 68 and 84
Housing Color
Dark brown
Packaging Type
Tubes (standard)
or tape and reel (optional)
Insulator Material
UL94V-0 high temperature thermoplastic
Compatible with IR reflow and wave
soldering
Current Rating
1.0 amps max. per contact
Contact Resistance
20 m max.
Voltage Rating
120 volts
Continuous Operating
-55°C to +125°C
Temperature
Durability (Mating Cycles)
50 cycles
Mating Force
180 grams/pin max.
Unmating Force
28.35 grams/pin min.
Plating (Contact Area)
4.57 m [180 in.] tin-lead over nickel
underplating
Plating (Soldering End)
4.57 m [180 in.] tin-lead over nickel
underplating
Underplating
1.14 m [45 in.] nickel
Standards, Approvals and
UL approved: UL File E134099
Certifications
Description
Plastic Leaded Chip Carriers (PLCCs) in electronic equipment have
created a need for socketing devices to attach to printed wiring
board assemblies. Delphi Connection Systems’ PLCC sockets provide
a cost-effective, upgradeable method of utilizing PLCCs. These low
profile 4.45 mm [.175 in.] sockets allow high-density PC board
stacking.
Delphi’s sockets utilize Surface Mount Technology (SMT) and are
available with or without a board polarization feature. This internal
polarization feature identifies proper chip carrier orientation.
Molded-in standoffs aid the solder cleaning process. Inspection
windows in the base help enable easy socket placement on the PC
board and facilitate solder joint repair and inspection. A center pad
provides an area for pick-and-place processes.
To help ensure correct removal of devices from sockets, an
extraction tool is available. This tool fits all socket sizes and has
a plastic handle with heat treated steel blades.
Tool Part Number: PLCCT2084
Typical Applications
Computers and peripherals
Office automation
Instrumentation
Benefits/Features:
Industry Standard . . . . These sockets interface with standard
1.27 mm [.050 in.] pitch PLCCs defined by
the JEDEC JC-11 committee and included in
JEDEC Publication 95.
Square packages meet the requirements of
MS-018.
Rectangular packages meet the
requirements of MO-052.
Performance Characteristics
Surface Mount
PLCC Sockets
Connection
Systems
Surface Mount
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