EN/LZT146056R4A EricssonPowerModules,March2007
PMC4318TWSDatasheet
ThePMCseriesDC/DCregulatorsareintendedforreflowsoldering
processes.Extraprecautionsmustbetakenwhenreflowsoldering
themodule.Neglectingthesolderinginformationgivenbelow
mayresultinpermanentdamageorsignificantdegradationofthe
powermoduleperformance.Noresponsibilityisassumedifthese
recommendationsarenotstrictlyfollowed.
Themodulecanbereflowsolderedusingvapourphasereflow(VPR)
orforcedconvectionreflow.
Toensurepropersolderingoftheregulatorsthetemperatureshould
bemonitoredoninterconnectionpinGND.Theinterconnection
GNDisconsideredasrepresentativeduetotheheavycopperpath
characterisation.AthermocouplecanbeattachedtothepinGND
bymeansofasuitableadhesiveorheatconductivepaste,seethe
mechanicaldataonpage4.
Thereflowprofileshouldbeoptimisedtoavoidsolderpastedrying
andoverheatingofthemodule.Mostimportantistoensurethatthe
interconnectionpinsonthecoldestaerareachsufficientsoldering
temperatureforsufficientlylongtime.Asufficientlyextendedsoak
timeisrecommendedtoensureaneventemperaturethroughout
thePCB,forbothsmallandlargecomponents.Toreducetheriskof
overheatingthepowermodule,itisalsorecommendedtominimise
thetimeinreflowasmuchaspossible.
Forleadfreesolderprocesses(soldermeltingpoint217°C),
thePMCseriesisqualifiedforMSL1accordingtoJEDECstandard
“J-STD-020c”.Duringreflow,themoduletemperaturemustnot
exceed+245°Catanytime.
Soldering Information
ForconventionalSn-Pbsolderprocesses(soldermeltingpoint
179°C-183°C),ThePMCseriesisqualifiedforMSL1according
toJEDECstandard“J-STD-020c”.Duringreflow,themodule
temperaturemustnotexceed+225°Catanytime.
0
70
140
210
280
350
0
50
100
150
200
250
300
[°C]
Time
reflow ramp-up
cooling
zone
preheat
max 3°/s
soak zone
(150°C-200°C)
60-180s
reflow
zone
max pin temperature
@ 225°C (Low temp solder)
@ 245°C (High temp solder)
(solid line)-High temperature solder
(dashed line)-Low temperature solder
Rampup,ramp-downrate
Pre-heat
Soakzone
Reflowzone
Cooling
max3C/s
max0.5C/s
max3C/s
max4C/s
Temperatureinterval,time
Soakzone
Reflowzone
130-170C, 60-120 s
Above183C, 30-80 s
Peaktemperature,time
Reflowzone
210-225C, 10-30 s
Low temperature solder - reflow profile
Rampup,ramp-downrate
Pre-heat
Soakzone
Reflowzone
Cooling
max3C/s
max0.5C/s
max3C/s
max4C/s
Temperatureinterval,time
Soakzone
Reflowzone
150-200C, 60-180 s
Above220C, 30-80 s
Peaktemperature,time
Reflowzone
235-245C, 10-30 s
High temperature solders - Reflow profile
Pintemperatures,graphofthe4-zonesofreflowsoldering.