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Pin Function
1
+Vin
2
–Vin
3
EN 1
4
EN 2
5
TEMP
6
Do Not Connect
7
Do Not Connect
8
Pin Not Present
9
Pin Not Present
PT4840 Series
—
48V
65-W Triple Output Isolated DC/DC
Converter for DSL Applications
Pin Function
10
Pin Not Present
11
+Vo
1
12
COM
13
COM
14
Pin Not Present
15
+Vo
2
16
+Vo
2
17
Vo
2
adjust
Pin Function
18
COM
19
COM
20
COM
21
Vo
3
adjust
22
+Vo
3
23
+Vo
3
24
Pin Not Present
25
Do Not Connect
26
Do Not Connect
On/Off Enable Logic
Pin Configuration
Pin Descriptions
Pin 3
Pin 4
Output Status
1
×
Off
0
1
On
×
0
Off
Notes:
Logic 1 =Open collector
Logic 0 = –Vin (pin 2) potential
For positive Enable function, connect pin 3
to pin 2 and use pin 4.
For negative Enable function, leave pin 4
open and use pin 3.
+Vin:
The positive input supply for the module with
respect to –Vin. When powering the module from a
–48V telecom central office supply, this input is
connected to the primary system ground.
–Vin:
The negative input supply for the module, and
the 0VDC reference for the EN 1, EN 2, and TEMP
inputs. When powering the module from a +48V
supply, this input is connected to the 48V(Return).
EN 1:
The negative logic input that activates the
module output. This pin is referenced to –V
in
. A
low-level voltage at this pin enables the module’s
outputs, and a high impedance impedance disables
the module’s outputs. If not used, the pin must be
connected to –V
in
.
EN 2:
The positive logic input that activates the
module output. This pin is referenced to –V
in
. A
high impedance at this pin enables the module’s
outputs. If not used, the pin should be left open
circuit.
TEMP:
This pin produces an output signal that tracks
a temperature that is approximately the module’s
metal case. The output voltage is referenced to –Vin
and rises approximately 10mV/°C from an intital
value of 0.1VDC at –40°C. The signal is available
whenever the module is supplied with a valid input
voltage, and is independant of the enable logic status.
(
Note:
A load impedance of less than 1M
will adversly
affect the module’s over-temperature shutdown threshold.
Use a high-impedance input when monitoring this signal.)
Vo 1:
The highest regulated output voltage, which is
referenced to the COM node. The output may be
used to power analog support circuitry.
Vo 2:
The regulated output that is designed to power
logic or I/O circuitry. It is referenced to the COM
node.
Vo 3:
The low-voltage regulated output that provides
power for a micro, processor, ASIC, or DSP core,
and is referenced to the COM node.
COM:
The secondary return reference for the module’s
three regulated output voltages. It is DC isolated from
the input supply pins.
Vo
2
Adjust:
Using a single resistor, this pin allows Vo
2
to be adjusted higher or lower than the preset value.
If not used, this pin should be left open circuit.
Vo
3
Adjust:
Using a single resistor, this pin allows Vo
3
to be adjusted higher or lower than the preset value.
If not used, this pin should be left open circuit.
Note: Shaded functions indicate those pins that are at primary-side potential.
SLTS142C - DECEMBER 2000 -REVISED SEPTEMBER 2002
Environmental Specifications
Characteristics
Symbols
Conditions
Min
Typ
Max
Units
Operating Temperature Range
Over-Temperature Protection
Solder Reflow Temperature
Storage Temperature
Mechanical Shock
T
a
OTP
T
reflow
T
s
Over V
in
Range
Case temperature
Surface temperature of module pins or case
—
Per Mil-STD-883D, Method 2002.3
1 msec, Sine, mounted
Mil-STD-883D Method 2007.2
20-2000 Hz
Vertical/Horizontal
Meets UL 94V-O
–40
100
—
–40
—
—
—
—
85
(i)
—
215
(ii)
125
°C
°C
°C
°C
—
—
—
—
500
10
(iii)
20
(iii)
90
—
—
—
—
G’s
G’s
Mechanical Vibration
Suffix N
Suffix A, C
Weight
Flammability
—
—
grams
Notes:
(i) See SOA curves or consult factory for appropriate derating.
(ii) During solder reflow of SMD package version do not elevate the module case, pins, or internal component temperatures above a peak of 215°C. For
further guidance refer to the application note, “Reflow Soldering Requirements for Plug-in Power Surface Mount Products,” (SLTA051).
(iii) Only the case pins on through-hole pin configurations (N & A) must be soldered. For more information see the applicable package outline drawing.