Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
PT6626M
NRND
SIP MOD
ULE
EEM
14
TBD
Call TI
PT6626P
NRND
SIP MOD
ULE
EED
14
12
Pb-Free
(RoHS)
Call TI
N / A for Pkg Type
PT6626Q
NRND
SIP MOD
ULE
EEQ
14
TBD
Call TI
PT6626R
NRND
SIP MOD
ULE
EEE
14
12
Pb-Free
(RoHS)
Call TI
N / A for Pkg Type
PT6627B
NRND
SIP MOD
ULE
EEK
14
12
Pb-Free
(RoHS)
Call TI
Level-1-215C-UNLIM
PT6627D
NRND
SIP MOD
ULE
EEA
14
TBD
Call TI
PT6627E
NRND
SIP MOD
ULE
EEC
14
TBD
Call TI
PT6627F
NRND
SIP MOD
ULE
EEF
14
TBD
Call TI
PT6627G
NRND
SIP MOD
ULE
EEG
14
TBD
Call TI
PT6627L
NRND
SIP MOD
ULE
EEL
14
TBD
Call TI
PT6627M
NRND
SIP MOD
ULE
EEM
14
TBD
Call TI
PT6627P
NRND
SIP MOD
ULE
EED
14
TBD
Call TI
PT6627Q
NRND
SIP MOD
ULE
EEQ
14
TBD
Call TI
PT6627R
NRND
SIP MOD
ULE
EEE
14
TBD
Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
PACKAGE OPTION ADDENDUM
www.ti.com
11-Nov-2009
Addendum-Page 3