TYPICAL CHARACTERISTICS (32-V INPUT)(1)(2)
0
10
30
20
40
50
60
70
80
V
-OutputV
olt
ageRipple-mV
O
PP
0
1
2
3
4
5
I
-OutputCurrent- A
O
V
=3.3V
O
V
=5V
O
V
=12V
O
V
=15V
O
V
=22V
O
0
1
2
3
4
5
0
1
2
3
4
5
IO -OutputCurrent- A
6
7
P
-PowerDissip
ation-W
D
V
=22V
O
V
=15V
O
V
=3.3V
O
V
=5V
O
V
=12V
O
0
1
2
3
4
5
40
45
50
55
60
65
70
75
80
85
90
95
100
Efficiency-%
I
-OutputCurrent- A
O
V
=3.3V
O
V
=5V
O
V
=12V
O
V
=22V
O
V
=15V
O
20
30
40
50
60
70
80
90
0
1
2
3
4
5
I
-OutputCurrent- A
O
200LFM
Natconv
Airflow
VO =5V
T
emperatureDerating-
C
°
100LFM
20
30
40
50
60
70
80
90
0
1
2
3
4
5
I
-OutputCurrent- A
O
200LFM
100LFM
Natconv
Airflow
VO =15V
T
emperatureDerating-
C
°
20
30
40
50
60
70
80
90
0
1
2
3
4
5
I
-OutputCurrent- A
O
200LFM
100LFM
Natconv
T
emperatureDerating-
C
°
Airflow
VO =12V
20
30
40
50
60
70
80
90
0
1
2
3
4
I
-OutputCurrent- A
O
Airflow
VO =22V
Natconv
100LFM
200LFM
T
emperatureDerating-
C
°
www.ti.com .................................................................................................................................................. SLTS228B – DECEMBER 2004 – REVISED APRIL 2008
EFFICIENCY
OUTPUT VOLTAGE RIPPLE
POWER DISSIPATION
vs
OUTPUT CURRENT
Figure 17.
Figure 18.
Figure 19.
TEMPERATURE DERATING
vs
OUTPUT CURRENT
Figure 20.
Figure 21.
Figure 22.
TEMPERATURE DERATING
vs
OUTPUT CURRENT
Figure 23.
(1)
The electrical characteristic data has been developed from actual products tested at 25
°C. This data is considered typical for the
(2)
The temperature derating curves represent the conditions at which internal components are at or below the manufacturer's maximum
operating temperatures. Derating limits apply to modules soldered directly to a 100 mm x 100 mm double-sided PCB with 2 oz. copper.
For surface mount packages (AS and AZ suffix), multiple vias (plated through holes) are required to add thermal paths around the power
pins. Please refer to the mechanical specification for more information. Applies to
Figure 20 through
Figure 23.
Copyright 2004–2008, Texas Instruments Incorporated
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