Q-Star Test nv, 2003
Due to continuous pursuit of innovation, the technical specifications listed are subject to change without notice.
Revision C - page 2 of 6
QA-1000HC
E
LECTRICAL
S
PECIFICATIONS
Measured at V
DUT
=+5.00V, V
CC
= +12.0V, V
EE
= -12.0V, T=20°C
S
YMBOL
P
ARAMETER
Power Supply
V
CC
Positive Supply Voltage
V
EE
Negative Supply Voltage
I
CCQ
Quiescent Supply Current @ I
DUT
=0mA
I
EEQ
Quiescent Supply Current @ I
DUT
=0mA
Input Range
I
DUT
DUT Supply Current
V
DUT
DUT Supply Voltage
(1)
I
VDUT
Input Bias Current
DC Accuracy
C
ONDITION
M
IN
T
YP
M
AX
U
NITS
+11.5
-11.5
+12
-12
+12
-12
+16
-16
+40
-40
V
V
mA
mA
0
2
A
V
-7.0
+7.0
2
μ
A
I
DUT
Resolution
(2)
@ C
L
=100nF, f
-3dB
=50kHz
@ C
L
=100nF, f
-3dB
=500kHz
@ C
L
=100nF, f
-3dB
=5MHz
0.3
1
2
2
0.1
2.5
mA
RMS
mA
RMS
mA
RMS
mA
I/V
AC Characteristics
Measurement Offset
Gain error
I/V Conversion Ratio
5
0.5
%
mV/mA
I
DUT
–3dB bandwidth
@ C
L
=100nF, JP2,3=OFF
@ C
L
=100nF, JP2=ON, JP3=OFF
@ C
L
=100nF, JP2=OFF, JP3=ON
@ C
L
=100nF, JP2,3=OFF
@ C
L
=100nF
5000
500
50
TBD
TBD
kHz
kHz
kHz
V/μs
dB
SR
THD Total Harmonic Distortion
DUT Output
I
DUT
DUT current
C
L
Loading Capacitance C
L
Internal Resistance
Between DUT & V
DUT
DUT – V
DUT
voltage drop
(1) The VDUT pin must be permanently connected to a voltage source and must notbe left floating.
(2) Considering clean supplies and no external noise pick up at VDUT/DUT terminals such as switching noise from ATE power
supply.
Slew Rate
-2
0
2
A
100
uF
@ I
DUT
=2A
25
50
m
mV
A
BSOLUTE
M
AXIMUM
R
ATINGS
Parameter
V
CC
V
EE
V
DUT
I
DUT
Operating Temperature Range
Storage Temperature
Lead Temperature (10sec)
(1)
With Respect To
GND
GND
GND
GND
Min
-0.3
-18
-0.3
-3
0
-40
Max
+18
+0.3
10
3
+70
+80
+220
Units
V
V
V
A
°C
°C
°C
(1)
Manual soldering is recommended using standard eutectic Sn63Pb solder.
NOTE: Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a
stress rating only; functional operation of the device at these or other conditions above those indicated in the operational sections
of this specification is not implied. Exposure to absolute maximum ratings for extended periods may affect device reliability.