![](http://datasheet.mmic.net.cn/160000/QESM012320HO3010FREQ1_datasheet_9693049/QESM012320HO3010FREQ1_4.png)
QESM012
SMD 7.0x5.0 Crystal – Ceramic SMD 2 pads packaged
Specification (rev-A)
July 05
st, 2006
3
TEMEX reserves the right to modify herein specifications and informations at any time when necessary to provide optimum performance and cost.
Freque ncy
Item
Code
Dimension
Tolerance
Pitch of components
P
8.0
± 0.1
Pitch of sprocket hole
Po
4.0
± 0.1
Length from hole center to component center
P1
2.0
± 0.1
Width of carrier tape
W
16.0
+0.3/-0.1
Width of adhesive tape
W0
7.5
± 0.1
Height of component hole
A
8.18
± 0.1
Width of component hole
B
5.56
± 0.1
Gap of hold down tape and carrier tape
W2
1.75
± 0.1
Diameter of sprocket hole
Do
1.5
± 0.05
Diameter of feed hole
D1
1.5
± 0.25
Total of tape thickness
K
2.16
± 0.1
Tape Drawing
Reel Drawing
Multiple : 1Kpcs per Reel
Unit : mm